Solid state UV laser technology for electronic packaging applications

被引：11

作者：

Lei, WS ^{[1
]}

Davignon, J ^{[1
]}

机构：

[1] Elect Sci Ind Inc, Portland, OR USA

来源：

LASERS IN MATERIAL PROCESSING AND MANUFACTURING II | 2005年 / 5629卷

关键词：

laser; wavelength; absorption; drilling; optics; beam positioning; electronic materials; electronic packaging;

D O I：

10.1117/12.571520

中图分类号：

T [工业技术];

学科分类号：

08 ;

摘要：

This presentation introduces solid state UV laser drilling technology for electronic packaging applications which mainly includes generating microvias in high-density interconnects (HDI) printed wiring boards (PWB) and integrated circuit (IC) chip packaging devices. The first three sections discuss the drilling process technology in terms of substrate materials, via quality requirements, laser-materials interaction, via formation processes, laser beam profiles, and system hardware. The remaining sections cover some typical application examples including via drilling, soldermask ablation, and routing to explain the UV laser process capability with the common PWB materials.

引用

页码：314 / 326

页数：13

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