Modern electronic packaging technology

被引：0
|
作者：
Bevan, MG [1 ]
Romenesko, BM [1 ]
机构：
[1] Johns Hopkins Univ, Appl Phys Lab, Tech Serv Dept, Elect Grp, Laurel, MD 20723 USA
来源：
JOHNS HOPKINS APL TECHNICAL DIGEST | 1999年 / 20卷 / 01期
关键词：
electronic components; electronic packaging; packaging design; packaging levels;
D O I：
暂无
中图分类号：
T [工业技术];
学科分类号：
08 ;
摘要：
A view of modem electronic packaging technology is presented along with its applications at APL. Although not always distinct, electronic packaging may be separated into three levels: component, board, and system. The manufacturing technologies and designs may vary at each level, but they all must provide electrical interconnection, thermal management, and mechanical and environmental protection. Each packaging level reflects a trade-off among many interrelated factors including design requirements, economics, and manufacturing infrastructure.
引用
收藏
页码：22 / 33
页数：12
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