Modern electronic packaging technology

被引：0

作者：

Bevan, MG ^{[1
]}

Romenesko, BM ^{[1
]}

机构：

[1] Johns Hopkins Univ, Appl Phys Lab, Tech Serv Dept, Elect Grp, Laurel, MD 20723 USA

来源：

JOHNS HOPKINS APL TECHNICAL DIGEST | 1999年 / 20卷 / 01期

关键词：

electronic components; electronic packaging; packaging design; packaging levels;

D O I：

暂无

中图分类号：

T [工业技术];

学科分类号：

08 ;

摘要：

A view of modem electronic packaging technology is presented along with its applications at APL. Although not always distinct, electronic packaging may be separated into three levels: component, board, and system. The manufacturing technologies and designs may vary at each level, but they all must provide electrical interconnection, thermal management, and mechanical and environmental protection. Each packaging level reflects a trade-off among many interrelated factors including design requirements, economics, and manufacturing infrastructure.

引用

页码：22 / 33

页数：12

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