共 50 条
- [41] 3D global interconnect parameter extractor for full-chip global critical path analysis ELECTRICAL PERFORMANCE OF ELECTRONIC PACKAGING, 1997, : 46 - 49
- [42] Powder LSI: An ultra small RF identification chip for individual recognition applications 2003 IEEE INTERNATIONAL SOLID-STATE CIRCUITS CONFERENCE: DIGEST OF TECHNICAL PAPERS, 2003, 46 : 398 - +
- [45] False path identification using RTL information and its application to over-testing reduction for delay faults PROCEEDINGS OF THE 16TH ASIAN TEST SYMPOSIUM, 2007, : 65 - +
- [46] 3D GIPER: Global interconnect parameter extractor for full-chip global critical path analysis IEDM - INTERNATIONAL ELECTRON DEVICES MEETING, TECHNICAL DIGEST 1996, 1996, : 615 - 618
- [49] A 249Mpixel/s HEVC Video-Decoder Chip for Quad Full HD Applications 2013 IEEE INTERNATIONAL SOLID-STATE CIRCUITS CONFERENCE DIGEST OF TECHNICAL PAPERS (ISSCC), 2013, 56 : 162 - U969