RRAM Computing-in-Memory Using Transient Charge Transferring for Low-Power and Small-Latency AI Edge Inference

被引:0
|
作者
Wang, Linfang [1 ,2 ]
An, Junjie [1 ]
Ye, Wang [1 ,2 ]
Li, Weizeng [1 ,2 ]
Gao, Hanghang [1 ,2 ]
He, Yangu [1 ]
Gao, Jianfeng [1 ]
Yue, Jinshan [1 ]
Fan, Lingyan [3 ]
Dou, Chunmeng [1 ,2 ]
机构
[1] Chinese Acad Sci, Inst Microelectron, Beijing, Peoples R China
[2] Univ Chinese Acad Sci, Sch Microelectron, Beijing, Peoples R China
[3] Hangzhou Dianzi Univ, Hangzhou, Peoples R China
来源
2022 IEEE ASIA PACIFIC CONFERENCE ON CIRCUITS AND SYSTEMS, APCCAS | 2022年
关键词
RRAM; computing-in-memory; AI processor; energy efficient system; multiply-and-accumulate; transient charge transferring; and parasitic capacitance; MACRO; CMOS; SRAM; EFFICIENT;
D O I
10.1109/APCCAS55924.2022.10090254
中图分类号
TP3 [计算技术、计算机技术];
学科分类号
0812 ;
摘要
RRAM-based computing-in-memory (CIM) can potentially improve the energy- and area-efficiency for AI edge processors, yet may still suffer from performance degradations due to the large DC current and parasitic capacitance in the cell array during computation. In this work, we propose a new CIM design leveraging the transient-charge-transferring (TCT) between the parasitic capacitors in the high-density foundry-compatible two-transistor-two-resistor (2T2R) RRAM array, which can perform DC-current-free multiply-and-accumulate (MAC) operations with improved energy-efficiency, reduced latency and enhanced signal margin. The concept of TCT-CIM is silicon demonstrated using a 180nm 400Kb RRAM test-chip, which has achieved 7.36 times power reduction compared to the conventional scheme and measured read access time less than 17.22 ns.
引用
收藏
页码:497 / 500
页数:4
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