RRAM Computing-in-Memory Using Transient Charge Transferring for Low-Power and Small-Latency AI Edge Inference

被引:0
|
作者
Wang, Linfang [1 ,2 ]
An, Junjie [1 ]
Ye, Wang [1 ,2 ]
Li, Weizeng [1 ,2 ]
Gao, Hanghang [1 ,2 ]
He, Yangu [1 ]
Gao, Jianfeng [1 ]
Yue, Jinshan [1 ]
Fan, Lingyan [3 ]
Dou, Chunmeng [1 ,2 ]
机构
[1] Chinese Acad Sci, Inst Microelectron, Beijing, Peoples R China
[2] Univ Chinese Acad Sci, Sch Microelectron, Beijing, Peoples R China
[3] Hangzhou Dianzi Univ, Hangzhou, Peoples R China
来源
2022 IEEE ASIA PACIFIC CONFERENCE ON CIRCUITS AND SYSTEMS, APCCAS | 2022年
关键词
RRAM; computing-in-memory; AI processor; energy efficient system; multiply-and-accumulate; transient charge transferring; and parasitic capacitance; MACRO; CMOS; SRAM; EFFICIENT;
D O I
10.1109/APCCAS55924.2022.10090254
中图分类号
TP3 [计算技术、计算机技术];
学科分类号
0812 ;
摘要
RRAM-based computing-in-memory (CIM) can potentially improve the energy- and area-efficiency for AI edge processors, yet may still suffer from performance degradations due to the large DC current and parasitic capacitance in the cell array during computation. In this work, we propose a new CIM design leveraging the transient-charge-transferring (TCT) between the parasitic capacitors in the high-density foundry-compatible two-transistor-two-resistor (2T2R) RRAM array, which can perform DC-current-free multiply-and-accumulate (MAC) operations with improved energy-efficiency, reduced latency and enhanced signal margin. The concept of TCT-CIM is silicon demonstrated using a 180nm 400Kb RRAM test-chip, which has achieved 7.36 times power reduction compared to the conventional scheme and measured read access time less than 17.22 ns.
引用
收藏
页码:497 / 500
页数:4
相关论文
共 41 条
  • [1] Computing-In-Memory & Processing-In-Sensor Techniques for Low-Power Edge Devices
    Tang, Kea-Tiong
    2020 INTERNATIONAL SYMPOSIUM ON VLSI DESIGN, AUTOMATION AND TEST (VLSI-DAT), 2020,
  • [2] Enabling Low-Power Charge-Domain Nonvolatile Computing-in-Memory (CIM) With Ferroelectric Memcapacitor
    Wang, Xuepei
    Cui, BoYao
    Jing, Lingling
    Wang, Xiaolin
    Wu, Maokun
    Wen, Yicheng
    Wu, Yishan
    Liu, Jinhao
    Zhang, Feilong
    Lin, Zidong
    Sun, Yanan
    Ren, Pengpeng
    Ye, Sheng
    Wang, Runsheng
    Ji, Zhigang
    Huang, Ru
    IEEE TRANSACTIONS ON ELECTRON DEVICES, 2024, 71 (04) : 2404 - 2410
  • [3] An ADC-Less RRAM-Based Computing-in-Memory Macro With Binary CNN for Efficient Edge AI
    Li, Yi
    Chen, Jia
    Wang, Linfang
    Zhang, Woyu
    Guo, Zeyu
    Wang, Jun
    Han, Yongkang
    Li, Zhi
    Wang, Fei
    Dou, Chunmeng
    Xu, Xiaoxin
    Yang, Jianguo
    Wang, Zhongrui
    Shang, Dashan
    IEEE TRANSACTIONS ON CIRCUITS AND SYSTEMS II-EXPRESS BRIEFS, 2023, 70 (06) : 1871 - 1875
  • [4] A Hybrid RRAM-SRAM Computing-In-Memory Architecture for Deep Neural Network Inference-Training Edge Acceleration
    Feng, Jiayun
    Wang, Yu
    Hu, Xianwu
    Wen, Gan
    Wang, Zeming
    Lin, Yukai
    Wu, Danqing
    Ma, Zizhao
    Zhao, Liang
    Lu, Zhichao
    Xie, Yufeng
    2021 SILICON NANOELECTRONICS WORKSHOP (SNW), 2021, : 65 - 66
  • [5] Considerations of Integrating Computing-In-Memory and Processing-In-Sensor into Convolutional Neural Network Accelerators for Low-Power Edge Devices
    Tang, Kea-Tiong
    Wei, Wei-Chen
    Yeh, Zuo-Wei
    Hsu, Tzu-Hsiang
    Chiu, Yen-Cheng
    Xue, Cheng-Xin
    Kuo, Yu -Chun
    Wen, Tai-Hsing
    Ho, Mon-Shu
    Lo, Chung-Chuan
    Liu, Ren-Shuo
    Hsieh, Chih-Cheng
    Chang, Meng-Fan
    2019 SYMPOSIUM ON VLSI CIRCUITS, 2019, : T166 - T167
  • [6] AI Edge Devices Using Computing-In-Memory and Processing-In-Sensor: From System to Device
    Hsu, Tzu-Hsiang
    Chiu, Yen-Cheng
    Wei, Wei-Chen
    Lo, Yun-Chen
    Lo, Chung-Chuan
    Liu, Ren-Shuo
    Tang, Kea-Tiong
    Chang, Meng-Fan
    Hsieh, Chih-Cheng
    2019 IEEE INTERNATIONAL ELECTRON DEVICES MEETING (IEDM), 2019,
  • [7] A 28-nm RRAM Computing-in-Memory Macro Using Weighted Hybrid 2T1R Cell Array and Reference Subtracting Sense Amplifier for AI Edge Inference
    Ye, Wang
    Wang, Linfang
    Zhou, Zhidao
    An, Junjie
    Li, Weizeng
    Gao, Hanghang
    Li, Zhi
    Yue, Jinshan
    Hu, Hongyang
    Xu, Xiaoxin
    Yang, Jianguo
    Liu, Jing
    Shang, Dashan
    Zhang, Feng
    Tian, Jinghui
    Dou, Chunmeng
    Liu, Qi
    Liu, Ming
    IEEE JOURNAL OF SOLID-STATE CIRCUITS, 2023, 58 (10) : 2839 - 2850
  • [8] A Multi-Bit Quantization Low-Latency Voltage Sense Amplifier Applied in RRAM Computing-in-Memory Macro Circuits
    Hu, Wei
    Zhang, Hangze
    Wei, Rongshan
    Chen, Qunchao
    ELECTRONICS, 2024, 13 (02)
  • [9] A Low-Power Charge-Domain Bit-Scalable Readout System for Fully-Parallel Computing-in-Memory Accelerators
    Mao, Wei
    Li, Fuyi
    Liu, Jun
    Xiao, Rui
    Huang, Kejie
    Li, Yongfu
    Yu, Hao
    Liu, Yan
    Han, Genquan
    IEEE TRANSACTIONS ON CIRCUITS AND SYSTEMS II-EXPRESS BRIEFS, 2024, 71 (06) : 2916 - 2920
  • [10] A high-reliability and low-power computing-in-memory implementation within STT-MRAM
    Zhang, Liuyang
    Deng, Erya
    Cai, Hao
    Wang, You
    Torres, Lionel
    Todri-Sanial, Aida
    Zhang, Youguang
    MICROELECTRONICS JOURNAL, 2018, 81 : 69 - 75