共 50 条
- [11] Effect of Multiple Reflowing Processes on Interfacial Reactions and Mechanical Properties between Sn-9.0 wt.%Zn, Sn-3.0 wt.%Ag-0.5 wt.%Cu Solders and Ag Substrate Journal of Electronic Materials, 2020, 49 : 257 - 267
- [14] Creep Behavior of As-Cast Mg-10 wt.%Sn and Mg-10 wt.%Sn-3 wt.%Al-1 wt.%Zn Alloys: A Comparative Study Journal of Materials Engineering and Performance, 2019, 28 : 7616 - 7628