Hybrid Integration Technology of Laser Source with Laser Diode Arrays on Silicon Optical Waveguide Platform by Flip-chip Bon ding for Silicon Photonics

被引：0
|
作者：
Shimizu, Takanori [1 ]
Hatori, Nobuaki [1 ]
Ishizaka, Masashige [1 ]
Urino, Yutaka [1 ]
Yamamoto, Tsuyoshi [1 ]
Nakamura, Takahiro [1 ]
Okano, Makoto [1 ]
Mori, Masahiko [1 ]
Arakawa, Yasuhiko [2 ]
机构：
[1] Photon Elect Technol Res Assoc, Inst Photon Elect Convergence Syst Technol PECST, Tsukuba, Ibaraki 3058569, Japan
[2] Univ Tokyo, Inst Ind Sci, Inst Photon Elect Convergence Syst Technol PECST, Meguro Ku, Tokyo 1538505, Japan
来源：
2013 IEEE 3RD CPMT SYMPOSIUM JAPAN (ICSJ 2013) | 2013年
关键词：
hybrid integration; flip-chip bonding; silicon photonics;
D O I：
暂无
中图分类号：
TM [电工技术]; TN [电子技术、通信技术];
学科分类号：
0808 ; 0809 ;
摘要：
Hybrid integration technology of a laser source ona silicon optical waveguide platform by flip-chip bonding for silicon photonics has been developed. Several types of integrated laser sources were demonstrated, including multi-channel, high-density and high temperature operation.
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页数：4
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