Hybrid Integration Technology of Laser Source with Laser Diode Arrays on Silicon Optical Waveguide Platform by Flip-chip Bon ding for Silicon Photonics

被引：0
|
作者：
Shimizu, Takanori [1 ]
Hatori, Nobuaki [1 ]
Ishizaka, Masashige [1 ]
Urino, Yutaka [1 ]
Yamamoto, Tsuyoshi [1 ]
Nakamura, Takahiro [1 ]
Okano, Makoto [1 ]
Mori, Masahiko [1 ]
Arakawa, Yasuhiko [2 ]
机构：
[1] Photon Elect Technol Res Assoc, Inst Photon Elect Convergence Syst Technol PECST, Tsukuba, Ibaraki 3058569, Japan
[2] Univ Tokyo, Inst Ind Sci, Inst Photon Elect Convergence Syst Technol PECST, Meguro Ku, Tokyo 1538505, Japan
来源：
2013 IEEE 3RD CPMT SYMPOSIUM JAPAN (ICSJ 2013) | 2013年
关键词：
hybrid integration; flip-chip bonding; silicon photonics;
D O I：
暂无
中图分类号：
TM [电工技术]; TN [电子技术、通信技术];
学科分类号：
0808 ; 0809 ;
摘要：
Hybrid integration technology of a laser source ona silicon optical waveguide platform by flip-chip bonding for silicon photonics has been developed. Several types of integrated laser sources were demonstrated, including multi-channel, high-density and high temperature operation.
引用
收藏
页数：4
相关论文
共 50 条
  • [31] Efficient and Optical Feedback Tolerant Hybrid Laser Design for Silicon Photonics Applications
    Columbo, Lorenzo
    Bovington, Jock
    Romero-Garcia, Sebastian
    Siriani, Dominic E.
    Gioannini, Mariangela
    IEEE JOURNAL OF SELECTED TOPICS IN QUANTUM ELECTRONICS, 2020, 26 (02)
  • [32] 53 GBd PAM-4 fully-integrated silicon photonics transmitter with a hybrid flip- chip bonded laser
    Yoo, Sanghwa
    Park, Heuk
    Lee, Jyung Chan
    Kang, Eun Kyu
    Huh, Joon Young
    Cho, Gye Sul
    Kang, Haechung
    Moon, Dae Woong
    Lee, Jong Jin
    Lee, Joon Ki
    OPTICS EXPRESS, 2022, 30 (23) : 41980 - 41998
  • [33] Silicon Photonics Hybrid Tunable Laser Diode with Wavelength Tuning Range Exceeding 150 nm
    Kita, T.
    Sato, R.
    Tsunoda, T.
    Nomura, A.
    Mori, R.
    Iwanaga, K.
    2024 IEEE 29TH INTERNATIONAL SEMICONDUCTOR LASER CONFERENCE, ISLC 2024, 2024,
  • [34] Hybrid HI-V laser integration on a monolithic silicon photonic platform
    Bian, Yusheng
    Ramachandran, Koushik
    Peng, Bo
    Hedrick, Brittany
    Mills, Scott
    Donegan, Keith
    Rundquist, Armand
    Vail, Ed
    Karra, Vaishnavi
    Yasar, Firat
    Esopi, Monica
    Fasano, Benjamin
    Sahin, Asli
    Houghton, Thomas
    Nummy, Karen
    Ding, Hanyi
    Hirokawa, Takako
    Dezfulian, Kevin
    Wu, Zhuojie
    Fisher, Daniel
    Pape, Jim
    Steffes, Jay
    Medina, Louis
    Roy, Subharup Gupta
    Cox, Harry
    Green, Bart
    Lubguban, Jorge
    Lee, Won Suk
    Aboketaf, Abdelsalam
    Rakowski, Michal
    McLean, Kate
    Sowinski, Zoey
    Kwon, Oh-Jung
    Robert, Gabrielle
    Sorbara, Massimo
    Krishnamurthy, Subramanian
    Stricker, Andy
    Cho, Jae Kyu
    Melville, Ian
    Riggs, Dave
    Augur, Rod
    Robson, Norman
    Berger, Daniel
    Lee, Luke
    Gupta, Vikas
    Yu, Anthony
    Giewont, Ken
    Letavic, Ted
    Pellerin, John
    2021 OPTICAL FIBER COMMUNICATIONS CONFERENCE AND EXPOSITION (OFC), 2021,
  • [35] Flip-chip assembly of VCSELs to silicon grating couplers via laser fabricated SU8 prisms
    Kaur, K. S.
    Subramanian, A. Z.
    Cardile, P.
    Verplancke, R.
    Van Kerrebrouck, J.
    Spiga, S.
    Meyer, R.
    Bauwelinck, J.
    Baets, R.
    Van Steenberge, G.
    OPTICS EXPRESS, 2015, 23 (22): : 28264 - 28270
  • [36] Dilute Waveguide Reflective Semiconductor Optical Amplifier for 3D Hybrid Silicon Photonics Integration
    Song, Bowen
    Luo, Youning
    Pinna, Sergio
    Liu, Yuan
    Klamkin, Jonathan
    2019 COMPOUND SEMICONDUCTOR WEEK (CSW), 2019,
  • [37] HYBRID INTEGRATION OF A LASER DIODE AND HIGH-SILICA MULTIMODE OPTICAL CHANNEL WAVE-GUIDE ON SILICON
    TERUI, H
    YAMADA, Y
    KAWACHI, M
    KOBAYASHI, M
    ELECTRONICS LETTERS, 1985, 21 (15) : 646 - 648
  • [38] Optoelectronic integration - Hybrid laser combines III-V gain with silicon waveguide
    Jones-Bey, HA
    LASER FOCUS WORLD, 2006, 42 (01): : 38 - +
  • [39] Coupling Device by Self-Written Waveguide Technology for Optical Interconnection between Silicon Photonics Chip and Fiber
    Fujikawa C.
    Mikami O.
    Journal of Japan Institute of Electronics Packaging, 2022, 25 (02) : 166 - 171
  • [40] Technology platform for hybrid integration of MOEMS on reconfigurable silicon micro-optical table
    Bargiel, S.
    Rabenorosoa, K.
    Mascaro, J-P.
    Clevy, C.
    Gorecki, C.
    Lutz, P.
    EUROSENSORS XXIV CONFERENCE, 2010, 5 : 428 - 431
12345