Hybrid Integration Technology of Laser Source with Laser Diode Arrays on Silicon Optical Waveguide Platform by Flip-chip Bon ding for Silicon Photonics

被引：0

作者：

Shimizu, Takanori ^{[1
]}

Hatori, Nobuaki ^{[1
]}

Ishizaka, Masashige ^{[1
]}

Urino, Yutaka ^{[1
]}

Yamamoto, Tsuyoshi ^{[1
]}

Nakamura, Takahiro ^{[1
]}

Okano, Makoto ^{[1
]}

Mori, Masahiko ^{[1
]}

Arakawa, Yasuhiko ^{[2
]}

机构：

[1] Photon Elect Technol Res Assoc, Inst Photon Elect Convergence Syst Technol PECST, Tsukuba, Ibaraki 3058569, Japan

[2] Univ Tokyo, Inst Ind Sci, Inst Photon Elect Convergence Syst Technol PECST, Meguro Ku, Tokyo 1538505, Japan

来源：

2013 IEEE 3RD CPMT SYMPOSIUM JAPAN (ICSJ 2013) | 2013年

关键词：

hybrid integration; flip-chip bonding; silicon photonics;

D O I：

暂无

中图分类号：

TM [电工技术]; TN [电子技术、通信技术];

学科分类号：

0808 ; 0809 ;

摘要：

Hybrid integration technology of a laser source ona silicon optical waveguide platform by flip-chip bonding for silicon photonics has been developed. Several types of integrated laser sources were demonstrated, including multi-channel, high-density and high temperature operation.

引用

页数：4

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