Characterization of differential via holes using equivalent circuit extraction technique

被引：7
|
作者：
Nguyen, Tao V. [1 ]
Morales, Aldo [1 ]
Agili, Sedig [1 ]
机构：
[1] Penn State Univ, Elect Engn Program, Harrisburg, PA 17057 USA
来源：
INTERNATIONAL JOURNAL OF RF AND MICROWAVE COMPUTER-AIDED ENGINEERING | 2007年 / 17卷 / 06期
关键词：
differential via; circuit extraction; characterization;
D O I：
10.1002/mmce.20256
中图分类号：
TP39 [计算机的应用];
学科分类号：
081203 ; 0835 ;
摘要：
A fast and accurate characterization method of differential via holes is presented based on the equivalent circuit extraction technique. A 3-D model of differential via holes is created and simulated using a full wave solver and the results are compared with the equivalent circuit model using Advanced Design System software. Results presented validate the proposed approach. (c) 2007 Wiley Periodicals, Inc.
引用
收藏
页码：552 / 559
页数：8
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