Modelling differential via holes

被引：0
|
作者：
Laermans, Eric [1 ]
De Geest, Jan [1 ]
De Zutter, Daniel [1 ]
Olyslager, Frank [1 ]
Sercu, Stefaan [1 ]
Morlion, Danny [1 ]
机构：
[1] Ghent Univ, Gent, Belgium
来源：
IEEE Topical Meeting on Electrical Performance of Electronic Packaging | 2000年
关键词：
D O I：
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学科分类号：
摘要：
Printed circuit boards
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页码：127 / 130
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