Modelling differential via holes

被引：0
|
作者：
Laermans, Eric [1 ]
De Geest, Jan [1 ]
De Zutter, Daniel [1 ]
Olyslager, Frank [1 ]
Sercu, Stefaan [1 ]
Morlion, Danny [1 ]
机构：
[1] Ghent Univ, Gent, Belgium
来源：
IEEE Topical Meeting on Electrical Performance of Electronic Packaging | 2000年
关键词：
D O I：
暂无
中图分类号：
学科分类号：
摘要：
Printed circuit boards
引用
收藏
页码：127 / 130
相关论文
共 50 条
  • [31] Modelling with ordinary differential equations
    Applied Mechanics Reviews, 1995, 48 (06):
  • [32] Economical Stamping of Holes with a Differential Path Press.
    Bohren, Statt
    Baender Bleche Rohre, 1984, 25 (03):
  • [33] Multiple Holes In The Lung! Add This To Your Differential Diagnosis
    Ramalingam, V.
    Dolan, S.
    Haasler, G.
    Rao, N.
    AMERICAN JOURNAL OF RESPIRATORY AND CRITICAL CARE MEDICINE, 2015, 191
  • [34] Assessment of blind via holes - an alternative approach
    Willis, Bob
    CIRCUIT WORLD, 2008, 34 (02) : 34 - 38
  • [35] Electroless copper plating of small via holes
    Abe, S.
    Ohkubo, M.
    Fujinami, T.
    Honma, H.
    Transactions of the Institute of Metal Finishing, 1998, 76 (pt 1): : 12 - 15
  • [36] Black Holes and Complexity via Constructible Universe
    Krol, Jerzy
    Klimasara, Pawel
    UNIVERSE, 2020, 6 (11)
  • [37] Equivalent network synthesis for via holes discontinuities
    Antonini, G
    Scogna, AC
    Orlandi, A
    IEEE TRANSACTIONS ON ADVANCED PACKAGING, 2002, 25 (04): : 528 - 536
  • [38] Superextremal spinning black holes via accretion
    Bode, Tanja
    Laguna, Pablo
    Matzner, Richard
    PHYSICAL REVIEW D, 2011, 84 (06)
  • [39] Nucleating black holes via nonorientable instantons
    Chamblin, A
    Gibbons, GW
    PHYSICAL REVIEW D, 1997, 55 (04): : 2177 - 2185
  • [40] 2 TECHNIQUES FOR CHARACTERIZING MMIC VIA HOLES
    SNOW, P
    WILSON, T
    MICROWAVES & RF, 1988, 27 (09) : 98 - &
12345