Design, manufacture and testing of a low-cost micro-channel cooling device

被引：0
|
作者：
Pang, AJ [1 ]
Desmulliez, MPY [1 ]
Leonard, M [1 ]
Dhariwal, RS [1 ]
Reuben, RL [1 ]
Holmes, AS [1 ]
Hong, G [1 ]
Pullen, KR [1 ]
Waldron, F [1 ]
Slattery, O [1 ]
Rencz, M [1 ]
Emerson, DR [1 ]
Barber, RW [1 ]
机构：
[1] Heriot Watt Univ, MISEC, Sch Engn & Phys Sci, Edinburgh EH14 4AS, Midlothian, Scotland
来源：
6TH ELECTRONICS PACKAGING TECHNOLOGY CONFERENCE, PROCEEDINGS (EPTC 2004) | 2004年
关键词：
D O I：
暂无
中图分类号：
T [工业技术];
学科分类号：
08 ;
摘要：
The modelling, simulation, fabrication and testing of a microchannel cooling plate are described in this article. The device is to be used in microelectronic packaging cooling applications. The nickel-based micro-channel cooling plate is fabricated on a glass substrate using a two-layer electroforming process borrowed from the UV-LIGA (UV-Lithography, Electroforming, Replication) process. Forced convection of air or liquid is scheduled for this microchannel plate. The cooling plate has been tested using a custom-made rig to measure the flow pressure head as a function of mass flow rate. Hydraulic performance of the cooling plate is presented.
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页码：564 / 568
页数：5
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