Design, manufacture and testing of a low-cost micro-channel cooling device

被引：0

作者：

Pang, AJ ^{[1
]}

Desmulliez, MPY ^{[1
]}

Leonard, M ^{[1
]}

Dhariwal, RS ^{[1
]}

Reuben, RL ^{[1
]}

Holmes, AS ^{[1
]}

Hong, G ^{[1
]}

Pullen, KR ^{[1
]}

Waldron, F ^{[1
]}

Slattery, O ^{[1
]}

Rencz, M ^{[1
]}

Emerson, DR ^{[1
]}

Barber, RW ^{[1
]}

机构：

[1] Heriot Watt Univ, MISEC, Sch Engn & Phys Sci, Edinburgh EH14 4AS, Midlothian, Scotland

来源：

6TH ELECTRONICS PACKAGING TECHNOLOGY CONFERENCE, PROCEEDINGS (EPTC 2004) | 2004年

关键词：

D O I：

暂无

中图分类号：

T [工业技术];

学科分类号：

08 ;

摘要：

The modelling, simulation, fabrication and testing of a microchannel cooling plate are described in this article. The device is to be used in microelectronic packaging cooling applications. The nickel-based micro-channel cooling plate is fabricated on a glass substrate using a two-layer electroforming process borrowed from the UV-LIGA (UV-Lithography, Electroforming, Replication) process. Forced convection of air or liquid is scheduled for this microchannel plate. The cooling plate has been tested using a custom-made rig to measure the flow pressure head as a function of mass flow rate. Hydraulic performance of the cooling plate is presented.

引用

页码：564 / 568

页数：5

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