Modeling electron transport in copper interconnect microstructures

被引：0

作者：

Nicholson, Don M. ^{[1
]}

Namilae, Sirish ^{[1
]}

Radhakrishnan, Bala ^{[1
]}

Zhang, X. -G ^{[1
]}

Kulkarni, Nagraj

机构：

[1] Oak Ridge Natl Lab, Div Math & Comp Sci, Oak Ridge, TN 37831 USA

来源：

ADVANCED METALLIZATION CONFERENCE 2007 (AMC 2007) | 2008年 / 23卷

关键词：

D O I：

暂无

中图分类号：

T [工业技术];

学科分类号：

08 ;

摘要：

Present efforts to minimize the resistivity of copper interconnects are discussed in terms of a comprehensive understanding of microstructure and electron scattering. A general approach for modeling resistivity that includes Monte-Carlo simulation of grain growth, first-principles modeling for grain boundary (GB) and interfacial resistivities, and a stochastic simulation for electron transport is presented. Determination of GB resistivities for Sigma 3 twin boundaries and Sigma 5 twist boundaries serve to illustrate steps in this approach.

引用

页码：595 / 599

页数：5

共 50 条

[41] Kinetic modeling of the photosynthetic electron transport chain
Berry, S
Rumberg, B
BIOELECTROCHEMISTRY, 2001, 53 (01) : 35 - 53
[42] COPPER INHIBITION OF MICROSOMAL ELECTRON-TRANSPORT REACTIONS
WERRINGLOER, J
KAWANO, S
ESTABROOK, RW
FEDERATION PROCEEDINGS, 1979, 38 (03) : 732 - 732
[43] Computer modeling of electron and proton transport in chloroplasts
Tikhonov, Alexander N.
Vershubskii, Alexey V.
BIOSYSTEMS, 2014, 121 : 1 - 21
[44] Electron transport in the carbon-copper nanocluster structure
L. V. Lutsev
S. V. Yakovlev
V. I. Siklitskii
Physics of the Solid State, 2000, 42 : 1139 - 1146
[45] Modeling the Transport and Reaction Mechanisms of Copper Oxide CVD
Arana-Chavez, David
Toumayan, Edward
Lora, Federico
McCaslin, Christopher
Adomaitis, Raymond A.
CHEMICAL VAPOR DEPOSITION, 2010, 16 (10-12) : 336 - 346
[46] Modeling Copper Transport in Saturated Sandy Loam Column
Ji, Shuhua
Wu, Meiling
ADVANCES IN ENVIRONMENTAL TECHNOLOGIES, PTS 1-6, 2013, 726-731 : 2428 - +
[47] Electrical modeling of Copper and Mixed Carbon bundles as a composite for 3D Interconnect applications
Rao, Madhav
2020 IEEE 15TH INTERNATIONAL CONFERENCE ON NANO/MICRO ENGINEERED AND MOLECULAR SYSTEM (IEEE NEMS 2020), 2020, : 495 - 499
[48] Heme-Copper Oxidases and Their Electron Donors in Cyanobacterial Respiratory Electron Transport
Bernroitner, Margit
Zamocky, Marcel
Pairer, Martin
Furtmueller, Paul G.
Peschek, Guenter A.
Obinger, Christian
CHEMISTRY & BIODIVERSITY, 2008, 5 (10) : 1927 - 1961
[49] Modeling of thermo-mechanical stresses in copper interconnect/low-k dielectric systems
Shen, Y. -L.
Advances in Electronic Packaging 2005, Pts A-C, 2005, : 1323 - 1330
[50] Modeling of Graphene for Interconnect Applications
Contino, A.
Ciofi, I.
Politou, M.
Verkest, D.
Mocuta, D.
Soree, B.
Groeseneken, G.
2016 IEEE INTERNATIONAL INTERCONNECT TECHNOLOGY CONFERENCE / ADVANCED METALLIZATION CONFERENCE (IITC/AMC), 2016, : 45 - 47

← 1 2 3 4 5 →