New composite organic dielectric for high performance flip chip single chip packages

A new composite organic dielectric has been developed which allows the production of reliable high performance single chip packages using modified printed circuit board construction techniques. The tailored coefficient of thermal expansion (CTE), dimensional stability, low dielectric constant, high glass transition temperature and thin nature of the new dielectric are well suited to the requirements of flip chip packaging. The properties and processing of the new dielectric will be reviewed and results of reliability testing will be offered in this presentation.