Preparation of α-alumina-g-polyacrylamide composite abrasive and chemical mechanical polishing behavior

被引:24
|
作者
Lei, Hong [1 ]
Lu, Haishen [1 ]
Luo, Jianbin [2 ]
Lu, Xinchun [2 ]
机构
[1] Shanghai Univ, Res Ctr Nanosci & Nanotechnol, Shanghai 200444, Peoples R China
[2] Tsinghua Univ, State Key Lab Tribol, Beijing 100084, Peoples R China
基金
中国国家自然科学基金;
关键词
chemical mechanical polishing; glass substrate; alpha-alumina; graft polymerization; composite abrasive;
D O I
10.1016/j.tsf.2007.11.050
中图分类号
T [工业技术];
学科分类号
08 ;
摘要
a-Alumina-g-polyacrylamide (alpha-Al2O3-g-PAM) composite abrasive was prepared by surface graft polymerization. The composition, structure and morphology of the product were characterized by Fourier transform infrared spectroscopy, X-ray photoelectron spectroscopy, time-of-flight secondary ion mass spectroscopy, and scanning electron microscopy, respectively. Then, the chemical mechanical polishing performances of the composite abrasive on glass substrates were investigated. Atomic force microscopy images show that the average roughness of the polished glass substrate surface can be decreased from 0.74 nm for pure alpha-Al2O3 abrasive to 0.45 nm for alpha-Al2O3-g-PAM abrasive. (c) 2007 Elsevier B.V. All rights reserved.
引用
收藏
页码:3005 / 3008
页数:4
相关论文
共 50 条
  • [31] Material Removal Behavior of Nano-sized Cerium Hydroxide Abrasive Slurry for Chemical Mechanical Polishing
    Kim, Hong Jin
    Lee, Tae Hoon
    Ryan, Anne
    CHEMICAL MECHANICAL POLISHING 14, 2016, 72 (18): : 27 - 36
  • [32] Molecular dynamics simulation of abrasive characteristics and interfaces in chemical mechanical polishing
    Van-Thuc Nguyen
    Te-Hua Fang
    APPLIED SURFACE SCIENCE, 2020, 509
  • [33] Effects of mixed abrasive slurry in oxide-chemical mechanical polishing
    Seo, YJ
    Lee, WS
    JOURNAL OF THE KOREAN PHYSICAL SOCIETY, 2004, 45 : S618 - S621
  • [34] Development of a semi-rigid abrasive pad for chemical mechanical polishing
    Kim, HY
    Kim, HJ
    Jeong, HD
    ABRASIVE TECHNOLOGY: CURRENT DEVELOPMENT AND APPLICATIONS I, 1999, : 200 - 206
  • [35] Effect of Abrasive and Surfactant on Chemical Mechanical Polishing of Hard Disk Substrates
    Wang, Shengli
    Li, Zhenxia
    Yang, Libing
    Liu, Libin
    Tian, Yu
    ADVANCED MANUFACTURING TECHNOLOGY, PTS 1-3, 2011, 314-316 : 133 - +
  • [36] Study of Polishing Characteristics of Monodisperse Ceria Abrasive in Chemical Mechanical Planarization
    Yang, Ji Chul
    Kim, Ho-joong
    Kim, Taesung
    JOURNAL OF THE ELECTROCHEMICAL SOCIETY, 2010, 157 (03) : H235 - H240
  • [37] Self-conditioning of encapsulated abrasive pad in chemical mechanical polishing
    Kim, H
    Kim, H
    Jeong, H
    Seo, H
    Lee, S
    JOURNAL OF MATERIALS PROCESSING TECHNOLOGY, 2003, 142 (03) : 614 - 618
  • [38] Chemical mechanical polishing of dielectric films using mixed abrasive slurries
    Jindal, A
    Hegde, S
    Babu, SV
    JOURNAL OF THE ELECTROCHEMICAL SOCIETY, 2003, 150 (05) : G314 - G318
  • [39] Surface planarization of zirconia ceramic achieved by polyacrylamide grafted nanodiamond composite abrasives through chemical mechanical polishing
    Ding R.
    Lei H.
    Xu L.
    Chen Y.
    Ceramics International, 2022, 48 (14): : 19900 - 19912
  • [40] Preparation of monodisperse polystyrene/silica core-shell nano-composite abrasive with controllable size and its chemical mechanical polishing performance on copper
    Zhang, Lei
    Wang, Haibo
    Zhang, Zefang
    Qin, Fei
    Liu, Weili
    Song, Zhitang
    APPLIED SURFACE SCIENCE, 2011, 258 (03) : 1217 - 1224