Successful modular process technology for system-on-a-chip applications

被引：0
|
作者：
Cochran, WT [1 ]
机构：
[1] Lucent Technol, Bell Labs, Microelect Grp, Orlando, FL USA
来源：
PROCEEDINGS OF THE IEEE 2001 CUSTOM INTEGRATED CIRCUITS CONFERENCE | 2001年
关键词：
D O I：
10.1109/CICC.2001.929811
中图分类号：
TM [电工技术]; TN [电子技术、通信技术];
学科分类号：
0808 ; 0809 ;
摘要：
By traditional standards, virtually all state-of-the-art technology offerings are, to some degree, modular. The role of various modular process technologies on systems-on-a-chip is explored. Keys to successful development of modular process technology are reviewed. Examples of modular process technology usage for the VLSI system chips are given, along with potential and actual issues encountered. Cost/benefit issues are examined and the future of modular process technology and system-on-a-chip design is explored.
引用
收藏
页码：407 / 412
页数：6
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