Manufacturing technology for polymer electronics packaging

被引：0
|
作者：
Liu, JH
机构：
来源：
JOURNAL OF ELECTRONICS MANUFACTURING | 1997年 / 7卷 / 04期
关键词：
D O I：
暂无
中图分类号：
T [工业技术];
学科分类号：
08 ;
摘要：
引用
收藏
页码：U3 / U3
页数：1
相关论文
共 50 条
  • [41] Isotropic conductive adhesive interconnect technology in electronics packaging applications
    Morris, James E.
    Lee, Jeahuck
    Liu, Johan
    POLYTRONIC 2005, PROCEEDINGS, 2005, : 45 - 52
  • [42] Overview of conductive adhesive joining technology in electronics packaging applications
    Liu, JH
    Lai, ZH
    Kristiansen, H
    Khoo, C
    3RD INTERNATIONAL CONFERENCE ON ADHESIVE JOINING AND COATING TECHNOLOGY IN ELECTRONICS MANUFACTURING 1998, PROCEEDINGS, 1998, : 1 - 18
  • [43] 30 Years Life in Asia+ with Electronics Packaging Technology
    Onishi T.
    Journal of Japan Institute of Electronics Packaging, 2023, 26 (06) : 556 - 560
  • [44] The use of multichip module technology for power electronics miniaturization and packaging
    Burgers, KC
    Olejniczak, KJ
    Ang, SS
    Porter, E
    APEC '97 - TWELFTH ANNUAL APPLIED POWER ELECTRONICS CONFERENCE AND EXPOSITION, VOLS 1 AND 2, 1997, : 35 - 41
  • [45] Reliability aspects of electronics packaging technology using conductive adhesives
    Liu, Johan
    Lu, Xiu Zheng
    Cao, Liqiang
    Polytronic 2005, Proceedings, 2005, : 235 - 235
  • [46] Next generation electronics packaging utilizing flip chip technology
    Pascariu, G
    Cronin, P
    Crowley, D
    IEEE/CPMT/SEMI(R) 28TH INTERNATIONAL ELECTRONICS MANUFACTURING TECHNOLOGY SYMPOSIUM, 2003, : 423 - 426
  • [47] Silicon Nitride Substrate Technology for Extreme Environment Electronics Packaging
    Johnson, Wayne
    Savrun, Ender
    2012 IEEE AEROSPACE CONFERENCE, 2012,
  • [48] Development of manufacturing processes for novel electronics by print technology
    Ushijima H.
    Nomura K.-I.
    Kusaka Y.
    Kanazawa S.
    Horii Y.
    Fujita M.
    Yamamoto N.
    Journal of Japan Institute of Electronics Packaging, 2018, 21 (06) : 567 - 572
  • [49] IMPACT OF SURFACE MOUNT TECHNOLOGY ON ELECTRONICS MANUFACTURING.
    Derman, Glenda
    Microelectronics Journal, 1986, 17 (02) : 5 - 11
  • [50] Information Technology Governance In The Malaysian Electronics Manufacturing Industry
    Tan, Khong Sin
    Eze, Uchenna Cyril
    Teo, Wil Ly
    INNOVATION AND KNOWLEDGE MANAGEMENT IN BUSINESS GLOBALIZATION: THEORY & PRACTICE, VOLS 1 AND 2, 2008, : 587 - 593
12345