Overview of conductive adhesive joining technology in electronics packaging applications

被引：0
|
作者：
Liu, JH [1 ]
Lai, ZH [1 ]
Kristiansen, H [1 ]
Khoo, C [1 ]
机构：
[1] Swedish Inst Prod Engn Res, IVF, SE-43153 Molndal, Sweden
来源：
3RD INTERNATIONAL CONFERENCE ON ADHESIVE JOINING AND COATING TECHNOLOGY IN ELECTRONICS MANUFACTURING 1998, PROCEEDINGS | 1998年
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D O I：
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中图分类号：
T [工业技术];
学科分类号：
08 ;
摘要：
This paper presents an overview of current status of use of conductive adhesives in various electronics packaging applications. Strong effort is put towards the recent development of surface mount and flip-chip technology as these methods in combination with conductive adhesives represent latest development in the area of electronics packaging. It is concluded that little practical use of conductive adhesives in surface mount has been found. In flip-chip applications, both isotropically and anisotropically conductive adhesives (ICA and ACAs) have been used in real applications. More use is expected in the nearest future in this fast developing area.
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页码：1 / 18
页数：18
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