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- [3] Overview of conductive adhesive joining technology in electronics packaging applications 3RD INTERNATIONAL CONFERENCE ON ADHESIVE JOINING AND COATING TECHNOLOGY IN ELECTRONICS MANUFACTURING 1998, PROCEEDINGS, 1998, : 1 - 18
- [4] Adhesive and conductive adhesive flip chip bonding Proceedings of the International Symposium and Exhibition on Advanced Packaging Materials Processes, Properties and Interfaces, 1997, : 117 - 119
- [5] Adhesive and conductive adhesive flip chip bonding 3RD INTERNATIONAL SYMPOSIUM ON ADVANCED PACKAGING MATERIALS - PROCESSES, PROPERTIES, AND INTERFACES - PROCEEDINGS, 1997, : 117 - 119
- [6] Resistance welding, explosive joining, roll bonding, magnetic bonding, adhesive bonding and mechanical joining Yosetsu Gakkai Shi, 5 (383-386): : 383 - 386
- [7] Comparing adhesive bonding and LAMP joining technology in case of hybrid material combination 8TH INTERNATIONAL CONFERENCE ON LASER ASSISTED NET SHAPE ENGINEERING (LANE 2014), 2014, 56 : 818 - 823
- [8] Adhesive joining process and thermomechanical property of anisotropic conductive adhesive ABSTRACTS OF PAPERS OF THE AMERICAN CHEMICAL SOCIETY, 2009, 238
- [9] Resistance welding, explosive joining, roll bonding, magnetic bonding, adhesive bonding, mechanical joining and other joining techniques Yosetsu Gakkai Shi/Journal of the Japan Welding Society, 2011, 80 (05): : 82 - 85
- [10] Conductive adhesive technology Suganuma, K., 2013, Japan Society for Precision Engineering, Kudan Seiwa Bldg, 1-5-9 Kudan-Kita, Chiyoda-ku, Tokyo, 102-0073, Japan (79):