共 50 条
- [42] 3D Electro-Optical Integration Based on High-Performance Si Photonics TSV Interposer 2016 OPTICAL FIBER COMMUNICATIONS CONFERENCE AND EXHIBITION (OFC), 2016,
- [43] 3D Integration of CMOS-compatible Surface Electrode Ion Trap and Silicon Photonics for Scalable Quantum Computing 2019 IEEE 69TH ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE (ECTC), 2019, : 1735 - 1743
- [44] Optical Coupling of 3D Silicon Micromirrors 2018 13TH ANNUAL IEEE INTERNATIONAL CONFERENCE ON NANO/MICRO ENGINEERED AND MOLECULAR SYSTEMS (NEMS 2018), 2018, : 465 - 470
- [45] Optimal Data Rates for Electrical Links and Opportunities for 3D Integration and Photonics 2010 23RD ANNUAL MEETING OF THE IEEE PHOTONICS SOCIETY, 2010, : 104 - 105
- [46] Design Benefits of Hybrid Bonding for 3D Integration IEEE 71ST ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE (ECTC 2021), 2021, : 1876 - 1881
- [47] A 3D Hybrid Integration Methodology for Terabit Transceivers 2015 SBMO/IEEE MTT-S INTERNATIONAL MICROWAVE AND OPTOELECTRONICS CONFERENCE (IMOC), 2015,
- [49] 2D AND 3D INTEGRATION WITH ORGANIC AND SILICON ELECTRONICS 2011 DESIGN, AUTOMATION & TEST IN EUROPE (DATE), 2011, : 899 - 904