Mixed mode fracture toughness characterization for interface and interlayer cracks in adhesive bonded joints

被引：5
|
作者：
Pang, HLJ [1 ]
Bong, SN [1 ]
Shi, XQ [1 ]
Wang, ZP [1 ]
机构：
[1] Nanyang Technol Univ, Sch Mech & Prod Engn, Singapore 639798, Singapore
来源：
PROCEEDINGS OF INTERNATIONAL SYMPOSIUM ON ELECTRONIC MATERIALS AND PACKAGING | 2000年
关键词：
D O I：
10.1109/EMAP.2000.904154
中图分类号：
TM [电工技术]; TN [电子技术、通信技术];
学科分类号：
0808 ; 0809 ;
摘要：
An approach based on fracture mechanics was employed to assess adhesive bond failure. Two types of fracture specimens were investigated. The Brazilian Nut Sandwich (BNS) specimen and the Compact Mixed Mode (CMM) specimen were used to determined the fracture toughness of adhesive joints. Fracture toughness measurements for interface crack and interlayer crack specimens were investigated. Mixed mode fracture criteria for interface or interlayer crack in adhesive bonded joint were developed. The results showed that the mode II fracture toughness generally displayed a larger value than the mode I toughness. In the case of CMM specimen, fracture toughness for interface crack fracture toughness is lower than that for a cohesive interlayer crack failure. Failure analysis diagrams were generated for both interlayer and interface crack configurations.
引用
收藏
页码：197 / 200
页数：4
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