Electronic packaging research and education: A model for the 21st century

被引：0

作者：

Tummala, RR ^{[1
]}

机构：

[1] Georgia Inst Technol, Low Cost Elect Pkg Res Ctr, Atlanta, GA 30332 USA

来源：

JOHNS HOPKINS APL TECHNICAL DIGEST | 1999年 / 20卷 / 01期

关键词：

integrated packaging; low-cost packaging; microelectronics; packaging; packaging education;

D O I：

暂无

中图分类号：

T [工业技术];

学科分类号：

08 ;

摘要：

引用

页码：111 / 121

页数：11

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