Electronic packaging research and education: A model for the 21st century

被引：0
|
作者：
Tummala, RR [1 ]
机构：
[1] Georgia Inst Technol, Low Cost Elect Pkg Res Ctr, Atlanta, GA 30332 USA
来源：
JOHNS HOPKINS APL TECHNICAL DIGEST | 1999年 / 20卷 / 01期
关键词：
integrated packaging; low-cost packaging; microelectronics; packaging; packaging education;
D O I：
暂无
中图分类号：
T [工业技术];
学科分类号：
08 ;
摘要：
引用
收藏
页码：111 / 121
页数：11
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