ZnO Film Flexible Printed Circuit Board pH Sensor Measurement and Characterization

被引：10
|
作者：
Yang, Po-Hui [1 ]
Chan, Che-Tsung [1 ]
Zhang, Ying-Sheng [1 ]
机构：
[1] Natl Yunlin Univ Sci & Technol, Grad Sch Elect Engn, Touliu 64002, Taiwan
来源：
IEEE ACCESS | 2022年 / 10卷
关键词：
Zinc oxide; II-VI semiconductor materials; Voltage measurement; Sensors; Electrodes; Substrates; Flexible printed circuits; Stability analysis; pH sensor; biosensor; zinc oxide (ZnO); flexible printed circuit board (FPCB); FIELD-EFFECT TRANSISTOR; RUTHENIUM DIOXIDE; FIBER; TEMPERATURE; BIOSENSOR; MECHANISM; PERFORMANCE; NANORODS; XPS;
D O I：
10.1109/ACCESS.2022.3205320
中图分类号：
TP [自动化技术、计算机技术];
学科分类号：
0812 ;
摘要：
An electrochemical zinc oxide (ZnO) pH sensor is proposed and prototyped using a flexible printed circuit board (FPCB). The device is resistant to acidic and alkaline solutions and exhibits excellent electrical conductivity. The sensing film was deposited by radio-frequency sputtering, providing a dense ZnO layer, and (3-aminopropyl)triethoxysilane (APTES) was used to enhance the chemical stability of the ZnO in acidic solutions. The proposed pH sensor has an average sensitivity of 37.52 mV/pH, linearity of 0.995, and a repeatable RSD value of 2.4%. Testing was conducted with Carmody's buffer pH 2-10 and a voltage-time measurement system. The stability of the prototype was determined by the measurement of the drift and hysteresis effects.
引用
收藏
页码：96091 / 96099
页数：9
相关论文
共 50 条
  • [41] A Measurement System for Printed Circuit Board Parameters Based on Image
    Xiong, Bangshu
    Ou, Qiaofeng
    ICIEA: 2009 4TH IEEE CONFERENCE ON INDUSTRIAL ELECTRONICS AND APPLICATIONS, VOLS 1-6, 2009, : 2387 - +
  • [42] Fatigue behavior of thin Cu foils for flexible printed circuit board
    Han, Seungwoo
    Seo, Kijeong
    Kim, Wandoo
    Lee, Hakjoo
    Lee, Hyunwoo
    Shin, Jaeho
    Lee, Jaejoon
    ADVANCES IN NANOMATERIALS AND PROCESSING, PTS 1 AND 2, 2007, 124-126 : 1369 - +
  • [43] DMAB Effects in Electroless Ni Plating for Flexible Printed Circuit Board
    Kim, Hyung-Chul
    Rha, Sa-Kyun
    Lee, Youn-Seoung
    KOREAN JOURNAL OF MATERIALS RESEARCH, 2014, 24 (11): : 632 - 638
  • [44] Flexible Thermal Ground Planes Fabricated With Printed Circuit Board Technology
    Liew, Li-Anne
    Lin, Ching-Yi
    Lewis, Ryan
    Song, Susan
    Li, Qian
    Yang, Ronggui
    Lee, Y. C.
    JOURNAL OF ELECTRONIC PACKAGING, 2017, 139 (01)
  • [45] Quality control process improvement of flexible printed circuit board by FMEA
    Krasaephol, Siwaporn
    Chutima, Parames
    2017 INTERNATIONAL CONFERENCE ON SENSORS, MATERIALS AND MANUFACTURING (ICSMM 2017), 2018, 311
  • [46] Heat transfer enhancement by flexible printed circuit board's deformation
    Lim, C. H.
    Abdullah, M. Z.
    Azid, I. A.
    Khor, C. Y.
    INTERNATIONAL COMMUNICATIONS IN HEAT AND MASS TRANSFER, 2017, 84 : 86 - 93
  • [47] Flexible printed circuit board magnetic micromirror for laser marking/engraving
    Periyasamy, Karlmarx G. K.
    Zuo, Hui
    He, Siyuan
    JOURNAL OF MICROMECHANICS AND MICROENGINEERING, 2019, 29 (08)
  • [48] Fabrication of flexible optical printed circuit board (FO-PCB)
    Lee, Hyun-Shik
    An, Shin-Mo
    Lee, Seung Gol
    O, B. H.
    Park, Se Geon
    Lee, El-Hnag
    OPTOELECTRONIC INTEGRATED CIRCUITS IX, 2007, 6476
  • [49] Surface finishes of rolled copper foil for flexible printed circuit board
    Lee, Chang-Yong
    Moon, Won-Chul
    Jung, Seung-Boo
    MATERIALS SCIENCE AND ENGINEERING A-STRUCTURAL MATERIALS PROPERTIES MICROSTRUCTURE AND PROCESSING, 2008, 483-84 : 723 - 726
  • [50] Inventory Management System Development in a Flexible Printed Circuit Board Manufacturer
    Prajaksuwithee, Sakulthip
    Chutima, Parames
    2019 IEEE 6TH INTERNATIONAL CONFERENCE ON INDUSTRIAL ENGINEERING AND APPLICATIONS (ICIEA), 2019, : 246 - 250
12345