Using numerical simulation to optimize 300mm FOUP purging

被引：0
|
作者：
Bernard, R [1 ]
Kambara, H
Favre, A
Descamp, P
Roche, A
机构：
[1] Alcatel Vacuum Technol, Annecy, France
[2] INOPRO, Grenoble, France
[3] STMicroelect, Crolles, France
来源：
SOLID STATE TECHNOLOGY | 2003年 / 46卷 / 10期
关键词：
D O I：
暂无
中图分类号：
TM [电工技术]; TN [电子技术、通信技术];
学科分类号：
0808 ; 0809 ;
摘要：
The front-opening unified pod is synonymous with 300mm wafer handling and contamination control. However. simple intuitive purging of these pods apparently does not provide wafer cleanliness compatible with high yields. Rigorous simulation with computational fluid dynamic software shows just how pod purging can be improved.
引用
收藏
页码：71 / +
页数：3
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