Validating Foundry Technologies for Extended Mission Profiles

被引：4
|
作者：
van Dijk, K. [1 ]
Volf, P. A. J. [1 ]
Detcheverry, C. [1 ]
Yau, A. [2 ]
Ngan, P. [3 ]
Liang, Z. [1 ]
Kuper, F. G. [1 ,4 ]
机构：
[1] NXP Semicond, Nijmegen, Netherlands
[2] TSMC, Taipei, Taiwan
[3] NXP Semicond, San Jose, Costa Rica
[4] Univ Twente, POB 217, NL-7500 AE Enschede, Netherlands
来源：
2010 INTERNATIONAL RELIABILITY PHYSICS SYMPOSIUM | 2010年
关键词：
qualification strategy; HTOL; ppm level; test screens; guard band; SRAM Vddmin;
D O I：
10.1109/IRPS.2010.5488845
中图分类号：
TM [电工技术]; TN [电子技术、通信技术];
学科分类号：
0808 ; 0809 ;
摘要：
This paper presents a process qualification and characterization strategy that can extend the foundry process reliability potential to meet specific automotive mission profile requirements. In this case study, data and analyses are provided that lead to sufficient confidence for pushing the allowed mission profile envelope of a process towards more aggressive (automotive) applications.
引用
收藏
页码：111 / 116
页数：6
相关论文
共 50 条
  • [21] Enabling technologies for the TerraSAR mission
    Zahn, RW
    Velten, EH
    IGARSS 2000: IEEE 2000 INTERNATIONAL GEOSCIENCE AND REMOTE SENSING SYMPOSIUM, VOL I - VI, PROCEEDINGS, 2000, : 1174 - 1176
  • [22] Real-Time MOSFET Condition Monitoring for Variable Mission Profiles With a Dual Extended Kalman Filter
    Deckers, Martijn
    Van Cappellen, Leander
    Moschner, Jens
    Daenen, Michael
    Driesen, Johan
    IEEE TRANSACTIONS ON POWER ELECTRONICS, 2025, 40 (01) : 2219 - 2234
  • [23] INTERSTELLAR EXPLORATION MISSION PROFILES
    MORGENTHALER, GW
    ANNALS OF THE NEW YORK ACADEMY OF SCIENCES, 1969, 163 (A1) : 559 - +
  • [24] NEW FOUNDRY TECHNOLOGIES: CASTING, CLOSE TO THE FINAL DIMENSIONS
    Volkova, E. I.
    Sheler, P. R.
    JOURNAL OF MINING INSTITUTE, 2005, 165 : 46 - 48
  • [25] Pattern density methodology using IBM foundry technologies
    Scagnelli, David
    Grant, Casey
    Carrig, Keith
    Kemerer, Tim
    Landis, Howard
    McDevitt, Tom
    Sucharitaves, Jeanne-Tania
    Tsai, Esther
    Kumar, Mukesh
    Pastel, Paul
    57TH ELECTRONIC COMPONENTS & TECHNOLOGY CONFERENCE, 2007 PROCEEDINGS, 2007, : 1300 - +
  • [26] Evaluation of the Resource Efficiency of Foundry Technologies: Methodological Aspect
    Ardashkin, Igor B.
    Yakovlev, Alexey N.
    Martyushev, Nikita, V
    HIGH TECHNOLOGY: RESEARCH AND APPLICATIONS, 2014, 1040 : 912 - 916
  • [27] Radiation response and variability of advanced commercial foundry technologies
    Felix, James A.
    Dodd, Paul E.
    Shaneyfelt, Marty R.
    Schwank, James R.
    Hash, Gerald L.
    IEEE TRANSACTIONS ON NUCLEAR SCIENCE, 2006, 53 (06) : 3187 - 3194
  • [28] A Commercial Foundry Perspective of SiGe BiCMOS Process Technologies
    Preisler, Edward
    2020 IEEE BICMOS AND COMPOUND SEMICONDUCTOR INTEGRATED CIRCUITS AND TECHNOLOGY SYMPOSIUM (BCICTS), 2020,
  • [29] The novel application of Fourier thermal analysis in foundry technologies
    Svidro, Jozsef Tamas
    Dioszegi, Attila
    Toth, Judit
    JOURNAL OF THERMAL ANALYSIS AND CALORIMETRY, 2014, 115 (01) : 331 - 338
  • [30] Foundry practice as a field of application of recent communication technologies
    Ambos, E.
    Braman, M.
    Ver, R.
    Litejnoe Proizvodstvo, 1999, (07): : 50 - 51
12345