Investigation of vibration characteristics of bonded structures by time-averaged electronic speckle pattern interferometry

被引:12
|
作者
Wang, Wei-Chung [2 ]
Hsu, Jiong-Shiun [1 ]
机构
[1] Natl Formosa Univ, Dept Power Mech Engn, Yunlin Cty 632, Taiwan
[2] Natl Tsing Hua Univ, Dept Power Mech Engn, Hsinchu 30013, Taiwan
关键词
Bonded structures; Amplitude fluctuation electronic speckle pattern interferometry (AF-ESPI); Modal testing technique; BIMETAL THERMOSTATS; STRESSES; FILMS;
D O I
10.1016/j.optlaseng.2010.05.011
中图分类号
O43 [光学];
学科分类号
070207 ; 0803 ;
摘要
In this paper, the vibration characteristics of bonded structures were experimentally investigated by incorporating amplitude fluctuation electronic speckle pattern interferometry (AF-ESPI) with modal testing technique. A special casting procedure was employed to manufacture the naturally bonded structures to avoid the influence resulted from the adhesive Vibration characteristics of bonded structures with different geometrical combinations of constituent adherends and the influence of presence of an interfacial crack were investigated. (C) 2010 Elsevier Ltd. All rights reserved.
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页码:958 / 965
页数:8
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