Fatigue damage of ultrafine-grain copper in very-high cycle fatigue region

被引：28

作者：

Lukas, P. ^{[1
]}

Kunz, L. ^{[1
]}

Navratilova, L. ^{[1
]}

Bokuvka, O. ^{[2
]}

机构：

[1] Acad Sci Czech Republic, Inst Phys Mat, Brno 616062, Czech Republic

[2] Univ Zilina, Dept Mech Engn, Zilina 01026, Slovakia

来源：

MATERIALS SCIENCE AND ENGINEERING A-STRUCTURAL MATERIALS PROPERTIES MICROSTRUCTURE AND PROCESSING | 2011年 / 528卷 / 22-23期

关键词：

Ultrafine-grained microstructure; Ultrasonic fatigue; Crack initiation; Copper; POLYCRYSTALLINE COPPER; STRAIN LOCALIZATION; VHCF REGIME; BEHAVIOR; SLIP;

D O I：

10.1016/j.msea.2011.06.001

中图分类号：

TB3 [工程材料学];

学科分类号：

0805 ; 080502 ;

摘要：

Ultrafine-grained copper produced by ECAP technique was tested in ultrasonic fatigue in the region of lives from 10(8) to 2 x 10(10) cycles. The fatigue strength of ultrafine-grained copper is by a factor of 2 higher than that of conventional-grain copper. The occurrence of surface fatigue slip markings is rare. No grain coarsening was observed either in bulk or in areas underneath the surface slip markings. Localized collective grain-boundary slip of near-by oriented grains is considered to be the main damage mechanism leading to fatigue microcrack initiation either directly in the roots of surface intrusions or underneath the surface slip markings. (C) 2011 Elsevier B.V. All rights reserved.

引用

页码：7036 / 7040

页数：5

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