Fatigue damage of ultrafine-grain copper in very-high cycle fatigue region

被引:28
|
作者
Lukas, P. [1 ]
Kunz, L. [1 ]
Navratilova, L. [1 ]
Bokuvka, O. [2 ]
机构
[1] Acad Sci Czech Republic, Inst Phys Mat, Brno 616062, Czech Republic
[2] Univ Zilina, Dept Mech Engn, Zilina 01026, Slovakia
关键词
Ultrafine-grained microstructure; Ultrasonic fatigue; Crack initiation; Copper; POLYCRYSTALLINE COPPER; STRAIN LOCALIZATION; VHCF REGIME; BEHAVIOR; SLIP;
D O I
10.1016/j.msea.2011.06.001
中图分类号
TB3 [工程材料学];
学科分类号
0805 ; 080502 ;
摘要
Ultrafine-grained copper produced by ECAP technique was tested in ultrasonic fatigue in the region of lives from 10(8) to 2 x 10(10) cycles. The fatigue strength of ultrafine-grained copper is by a factor of 2 higher than that of conventional-grain copper. The occurrence of surface fatigue slip markings is rare. No grain coarsening was observed either in bulk or in areas underneath the surface slip markings. Localized collective grain-boundary slip of near-by oriented grains is considered to be the main damage mechanism leading to fatigue microcrack initiation either directly in the roots of surface intrusions or underneath the surface slip markings. (C) 2011 Elsevier B.V. All rights reserved.
引用
收藏
页码:7036 / 7040
页数:5
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