Development of ultra-precision double-disk grinding machine for silicon-wafer

被引：0
|
作者：
Hara, K [1 ]
Isobe, S [1 ]
Nagata, H [1 ]
Iwase, A [1 ]
Tomita, Y [1 ]
Kanai, A [1 ]
机构：
[1] Sumitomo Heavy Ind Ltd, Kanagawa 2540806, Japan
来源：
PROCEEDINGS OF THE FOURTEENTH ANNUAL MEETING OF THE AMERICAN SOCIETY FOR PRECISION ENGINEERING | 1999年
关键词：
D O I：
暂无
中图分类号：
T [工业技术];
学科分类号：
08 ;
摘要：
引用
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页码：559 / 562
页数：4
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