Machining characteristics on the ultra-precision dicing of silicon wafer

被引：16
|
作者：
Kim, Sung-Chul
Lee, Eun-Sang
Kim, Nam-Hun
Jeong, Hae-Do
机构：
[1] Inha Univ, Dept Mech Engn, Inchon 402751, South Korea
[2] Pusan Natl Univ, Sch Mech Engn, Pusan 609735, South Korea
来源：
INTERNATIONAL JOURNAL OF ADVANCED MANUFACTURING TECHNOLOGY | 2007年 / 33卷 / 7-8期
基金：
新加坡国家研究基金会;
关键词：
dicing; dicing force; silicon wafer; chipping;
D O I：
10.1007/s00170-006-0499-1
中图分类号：
TP [自动化技术、计算机技术];
学科分类号：
0812 ;
摘要：
Recently, the slightest damage to a circuit can cause great damage due to the sizes of semiconductor chips becoming smaller. To prevent damage to the circuit, the dicing process for silicon wafer must be controlled. In this study, the relationship between the chipping effect and the force of dicing was analyzed. The rate of chipping decreased with a decrease in the force of dicing. The force of dicing also decreased according to a lower feed rate and higher blade speed. The lower feed rate and the higher blade speed must be controlled to achieve a chip-free process.
引用
收藏
页码：662 / 667
页数：6
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