Stepwise Controlled Voltage Sensing Scheme for High-Density ReRAM with Multi Level Cell

被引:0
|
作者
Chun, Jin Young [1 ]
Park, Hyun-Kook [1 ]
Song, Byungkyu [1 ]
Jung, Seong-ook [1 ]
机构
[1] Yonsei Univ, Dept Elect & Elect Engn, Seoul, South Korea
关键词
Cross-point; High speed sensing; Multi-level cell (MLC); Nonvolatile memory; Resistive RAM (ReRAM); Single-level cell (SLC);
D O I
暂无
中图分类号
TM [电工技术]; TN [电子技术、通信技术];
学科分类号
0808 ; 0809 ;
摘要
In this paper, we study basic read methods of cross-point ReRAM which is a promising next generation memory. Based on this study, we propose a novel sensing method for Multi-Level ReRAM Cell without area penalty or read time degradation. By applying an increasing stepwise voltage to the gate of the nMOS switch that connects the sense amplifier with the cell array, the level of charge sharing between these two elements can be adjusted to a desired level. The proposed scheme achieves linear increase in reading time according cell resistance instead of the exponential in the conventional method. As a result, the reading time is improved by about twice as compared with the conventional method with applying the constant voltage.
引用
收藏
页码:332 / 335
页数:4
相关论文
共 50 条
  • [31] Excellent Selector Characteristics of Nanoscale VO2 for High-Density Bipolar ReRAM Applications
    Son, Myungwoo
    Lee, Joonmyoung
    Park, Jubong
    Shin, Jungho
    Choi, Godeuni
    Jung, Seungjae
    Lee, Wootae
    Kim, Seonghyun
    Park, Sangsu
    Hwang, Hyunsang
    [J]. IEEE ELECTRON DEVICE LETTERS, 2011, 32 (11) : 1579 - 1581
  • [32] Performance Comparison of O-based and Cu-based ReRAM for High-Density Applications
    Calderoni, Alessandro
    Sills, Scott
    Ramaswamy, Nirmal
    [J]. 2014 IEEE 6TH INTERNATIONAL MEMORY WORKSHOP (IMW), 2014,
  • [33] Cell Ratio Tuning for High-Density SRAM Voltage Scaling With Inserted-Oxide FinFETs
    Ding, Fei
    Zheng, Peng
    Connelly, Daniel
    Wu, Yi-Ting
    Liu, Tsu-Jae King
    [J]. IEEE ELECTRON DEVICE LETTERS, 2016, 37 (12) : 1539 - 1542
  • [34] Ferroelectric Engineering of FeFET Toward Multi-Level Coding for High-Density Nonvolatile Memory
    Lee, Min-Hung
    [J]. 2023 INTERNATIONAL VLSI SYMPOSIUM ON TECHNOLOGY, SYSTEMS AND APPLICATIONS, VLSI-TSA/VLSI-DAT, 2023,
  • [35] A Time-based Sensing Scheme for Multi-level Cell (MLC) Resistive RAM
    Reuben, John
    Fey, Dietmar
    [J]. 2019 IEEE NORDIC CIRCUITS AND SYSTEMS CONFERENCE (NORCAS) - NORCHIP AND INTERNATIONAL SYMPOSIUM OF SYSTEM-ON-CHIP (SOC), 2019,
  • [36] A HIGH-DENSITY, HIGH-PERFORMANCE EEPROM CELL
    SCHAUER, H
    VANTRAN, L
    SMITH, L
    [J]. IEEE TRANSACTIONS ON ELECTRON DEVICES, 1982, 29 (08) : 1178 - 1185
  • [37] DIFFUSION-CONTROLLED SORPTION IN HIGH-DENSITY DISCHARGES
    MADDIX, HS
    ALLEN, MA
    [J]. JOURNAL OF VACUUM SCIENCE & TECHNOLOGY, 1965, 2 (05): : 221 - &
  • [38] Voltage?current characteristics of high-density polyethylene conductive composites
    Liang, Ji-Zhao
    [J]. CHEMICAL ENGINEERING COMMUNICATIONS, 2020, 207 (01) : 84 - 92
  • [39] Retinal ganglion cell recordings with a high-density multi-electrode array.
    Normann, RA
    Richardson, E
    Guillory, KS
    [J]. INVESTIGATIVE OPHTHALMOLOGY & VISUAL SCIENCE, 2001, 42 (04) : S676 - S676
  • [40] Efficient sensing approaches for high-density memristor sensor array
    Adedotun Adeyemo
    Jimson Mathew
    Abusaleh Jabir
    Corrado Di Natale
    Eugenio Martinelli
    Marco Ottavi
    [J]. Journal of Computational Electronics, 2018, 17 : 1285 - 1296