SPICE-compatible full-wave equivalent circuit model for interconnect structures

被引：0

作者：

See, KY ^{[1
]}

Chua, EK ^{[1
]}

机构：

[1] Nanyang Technol Univ, Singapore 639798, Singapore

来源：

PROCEEDINGS OF 5TH ELECTRONICS PACKAGING TECHNOLOGY CONFERENCE | 2003年

关键词：

D O I：

10.1109/EPTC.2003.1271510

中图分类号：

TM [电工技术]; TN [电子技术、通信技术];

学科分类号：

0808 ; 0809 ;

摘要：

This paper presents the development of a SPICE-compatible full-wave equivalent circuit model for highspeed interconnect structures. By enforcing the necessary boundary conditions for the Maxwell's equations on the interconnect structures, the electric field integral equations (EFIEs) are formulated. Using the method of moments, the inductive and capacitive elements of the interconnect structure are extracted. Good agreement with the results obtained from EM simulator is demonstrated.

引用

页码：168 / 170

页数：3

共 50 条

[31] SPICE compatible equivalent circuit models of skeletal muscle tissue
Szlavik, R
De Bruin, H
[J]. PROCEEDINGS OF THE 18TH ANNUAL INTERNATIONAL CONFERENCE OF THE IEEE ENGINEERING IN MEDICINE AND BIOLOGY SOCIETY, VOL 18, PTS 1-5, 1997, 18 : 1766 - 1768
[32] Broadband frequency-domain electromagnetic analysis and automatic extraction of Spice-compatible equivalent circuits
Farina, M
Morini, A
Rozzi, T
[J]. ELECTRONICS LETTERS, 2005, 41 (22) : 1214 - 1215
[33] FULL-WAVE ANALYSIS FOR THE EQUIVALENT-CIRCUIT OF AN INCLINED SLOT ON A MICROSTRIP GROUND PLANE
BHATTACHARYYA, AK
ANTAR, YMM
ITTIPIBOON, A
[J]. IEE PROCEEDINGS-H MICROWAVES ANTENNAS AND PROPAGATION, 1992, 139 (03) : 245 - 250
[34] Full-wave Analysis and Equivalent Circuit Modeling of Substrate Integrated Waveguide (SIW) Circuits
Bozzi, Maurizio
Perregrini, Luca
Wu, Ke
[J]. 2014 INTERNATIONAL CONFERENCE ON NUMERICAL ELECTROMAGNETIC MODELING AND OPTIMIZATION FOR RF, MICROWAVE, AND TERAHERTZ APPLICATIONS (NEMO), 2014,
[35] Extrinsic equivalent circuit modeling of InP HEMTs based on full-wave electromagnetic simulation
Feng, Shi-Yu
Su, Yong-Bo
Ding, Peng
Zhou, Jing-Tao
Peng, Song-Ang
Ding, Wu-Chang
Jin, Zhi
[J]. CHINESE PHYSICS B, 2022, 31 (04)
[36] Extrinsic equivalent circuit modeling of InP HEMTs based on full-wave electromagnetic simulation
冯识谕
苏永波
丁芃
周静涛
彭松昂
丁武昌
金智
[J]. Chinese Physics B, 2022, 31 (04) : 681 - 689
[37] Recovery Modeling of Negative Bias Temperature Instability (NBTI) for SPICE-Compatible Circuit Aging Simulators
Kueflueoglu, Haldun
Chancellor, Cathy
Chen, Min
Cirba, Claude
Reddy, Vijay
[J]. ACM JOURNAL ON EMERGING TECHNOLOGIES IN COMPUTING SYSTEMS, 2014, 10 (01)
[38] An efficient SPICE-compatible circuit model for transmission line response excited by an electrically short dipole inside a metallic cavity
Yang, Jinpeng
Sun, Xiaoying
Zhao, Yu
Chen, Jian
Yan, Xuezhi
[J]. JOURNAL OF ELECTROMAGNETIC WAVES AND APPLICATIONS, 2019, 33 (10) : 1264 - 1286
[39] A SPICE-compatible mobility function for excimer laser annealed LTPS TFT analog circuit simulation
Li, Y.
Wang, C. -S.
[J]. SCIENTIFIC COMPUTING IN ELECTRICAL ENGINEERING, 2006, 9 : 351 - +
[40] SPICE-Compatible cavity and transmission line model for power bus with narrow slots
Feng, Gang
Zhang, Yao Jiang
Drewniak, James L.
Zhang, Lin
[J]. 2007 IEEE INTERNATIONAL SYMPOSIUM ON ELECTROMAGNETIC COMPATIBILITY: WORKSHOP AND TUTORIAL NOTES, VOLS 1-3, 2007, : 1066 - +

← 1 2 3 4 5 →