SPICE-compatible full-wave equivalent circuit model for interconnect structures

被引：0

作者：

See, KY ^{[1
]}

Chua, EK ^{[1
]}

机构：

[1] Nanyang Technol Univ, Singapore 639798, Singapore

来源：

PROCEEDINGS OF 5TH ELECTRONICS PACKAGING TECHNOLOGY CONFERENCE | 2003年

关键词：

D O I：

10.1109/EPTC.2003.1271510

中图分类号：

TM [电工技术]; TN [电子技术、通信技术];

学科分类号：

0808 ; 0809 ;

摘要：

This paper presents the development of a SPICE-compatible full-wave equivalent circuit model for highspeed interconnect structures. By enforcing the necessary boundary conditions for the Maxwell's equations on the interconnect structures, the electric field integral equations (EFIEs) are formulated. Using the method of moments, the inductive and capacitive elements of the interconnect structure are extracted. Good agreement with the results obtained from EM simulator is demonstrated.

引用

页码：168 / 170

页数：3

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