Damage constitutive model and failure mechanism of lead-free solder in CBGA package

被引：0
|
作者：
Hao, W. N. [1 ]
Chai, G. Z. [1 ]
Zhou, J. [1 ]
机构：
[1] Zhejiang Univ Technol, MOE Key Lab Mech Mfg & Automat, Hangzhou 310032, Zhejiang, Peoples R China
来源：
MATERIALS AND PRODUCT TECHNOLOGIES | 2008年 / 44-46卷
关键词：
lead-free solder; damage constitutive model; CBGA package; thermomechanical fatigue;
D O I：
10.4028/www.scientific.net/AMR.44-46.77
中图分类号：
T [工业技术];
学科分类号：
08 ;
摘要：
A viscoplastic constitutive model with void damage is developed to analyze the macroscopic mechanical response and damage mechanism of lead-free solder alloy in CBGA packaging under cyclic thermal loading. The constitutive model is implemented into ABAQUS through its user defined material subroutine. Two-dimensional nonlinear finite element analysis of a ceramic ball grid array(CBGA) package is conducted to simulate the viscoplastic deformation and damage failure process of the lead-free solder joint under cyclic thermal loading. The damage model is helpful for optimization and reliability of electronic package.
引用
收藏
页码：77 / 83
页数：7
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