An environmental perspective of lead-free solder based on damage assessment of LCIA

被引:0
|
作者
Itsubo, N [1 ]
Noh, J [1 ]
Inaba, A [1 ]
机构
[1] Natl Inst Adv Ind Sci & Technol, AIST, Tsukuba, Ibaraki 3058569, Japan
关键词
lead-free solder; health impact; life cycle impact assessment; disability adjusted life year; damage assessment;
D O I
10.2320/jinstmet.68.43
中图分类号
TF [冶金工业];
学科分类号
0806 ;
摘要
LCA (Life Cycle Assessment) has been attracted and been already spread to the public as a technique evaluating the environmental impacts of product life cycle. LCA case study for lead-free solder, which is expected as eco-material has already been performed, but most of these studies are focused on LCI (Life Cycle Inventory) and characterization in LCIA (Life Cycle Impact Assessment). In the case of the assessment of solder, the trade-off relationship between the human toxicity caused by the exposure of lead and global warming caused by the increase of energy use seems important. Conventional LCA case studies are difficult to solve this trade-off relationship, because LCI and characterization will not compare the seriousness of these environmental impacts. Based on the above background, we conducted LCIA case study of lead-free solder using LIME (Life-cycle Impact assessment Method based on Endpoint modeling). We concentrated on the damage assessment for human health in order to solve the trade-off relationship between the impact categories. DALY (Disability Adjusted Life Year) is applied as the damage indicator in this study. It can be concluded that damage assessment enables to evaluate reasonably with comparing the several health impacts based on the scientific knowledge.
引用
收藏
页码:43 / 45
页数:3
相关论文
共 50 条
  • [1] Damage assessment of human health for lead-free solder based on endpoint-type LCIA methodology
    Itsubo, N
    Noh, J
    Hayashi, K
    Inaba, A
    2003 3RD INTERNATIONAL SYMPOSIUM ON ENVIRONMENTALLY CONSCIOUS DESIGN AND INVERSE MANUFACTURING - ECODESIGN '03, 2003, : 836 - 837
  • [2] Constitutive and damage model for a lead-free solder
    Shengmin Wen
    Leon M. Keer
    Hareesh Mavoori
    Journal of Electronic Materials, 2001, 30 : 1190 - 1196
  • [3] Constitutive and damage model for a lead-free solder
    Wen, SM
    Keer, LM
    Mavoori, H
    JOURNAL OF ELECTRONIC MATERIALS, 2001, 30 (09) : 1190 - 1196
  • [4] Damage mechanics and experiments of lead-free solder alloy
    Zhou, Jun
    Hao, WeiNa
    Chai, GuoZhong
    2006 CONFERENCE ON OPTOELECTRONIC AND MICROELECTRONIC MATERIALS & DEVICES, 2006, : 286 - 289
  • [5] Isothermal fatigue damage model for lead-free solder
    Wei, Y
    Chow, CL
    Vianco, P
    Fang, F
    INTERNATIONAL JOURNAL OF DAMAGE MECHANICS, 2006, 15 (02) : 109 - 119
  • [6] A practical viscoplastic damage model for lead-free solder
    Fossum, AF
    Vianco, PT
    Neilsen, MK
    Pierce, DM
    JOURNAL OF ELECTRONIC PACKAGING, 2006, 128 (01) : 71 - 81
  • [7] Lead-free solder
    Black, H
    CHEMISTRY & INDUSTRY, 2005, (21) : 22 - 23
  • [8] Risk assessment methodology for lead-free solder assembly
    Charles Stark Draper Laboratory, 555 Technology Square, Cambridge, MA 02139-3563, United States
    Proc. - Int. Symp. Microelectron., IMAPS, (174-181):
  • [9] In pursuit of lead-free solder
    Birch, S
    AEROSPACE ENGINEERING, 2002, 22 (05) : 12 - 12
  • [10] The lead-free solder challenge
    Frear, Darrel
    Semicond Int, 11 (SP-20):