共 50 条
- [1] Damage assessment of human health for lead-free solder based on endpoint-type LCIA methodology 2003 3RD INTERNATIONAL SYMPOSIUM ON ENVIRONMENTALLY CONSCIOUS DESIGN AND INVERSE MANUFACTURING - ECODESIGN '03, 2003, : 836 - 837
- [2] Constitutive and damage model for a lead-free solder Journal of Electronic Materials, 2001, 30 : 1190 - 1196
- [4] Damage mechanics and experiments of lead-free solder alloy 2006 CONFERENCE ON OPTOELECTRONIC AND MICROELECTRONIC MATERIALS & DEVICES, 2006, : 286 - 289
- [8] Risk assessment methodology for lead-free solder assembly Proc. - Int. Symp. Microelectron., IMAPS, (174-181):