A drain extended FinFET with enhanced DC/RF performance for high-voltage RF applications

被引:2
|
作者
Oh, Kyounghwan [1 ]
Kim, Hyangwoo [2 ]
Park, Kangwook [3 ]
Lee, Hyung-jin [3 ]
Kong, Byoung Don [1 ]
Baek, Chang-Ki [1 ,2 ]
机构
[1] Pohang Univ Sci & Technol POSTECH, Dept Elect Engn, Pohang, South Korea
[2] Pohang Univ Sci & Technol POSTECH, Dept Convergence IT Engn, Pohang, South Korea
[3] Samsung Elect Co Ltd, Yongin, South Korea
关键词
FinFET; high-voltage; radio frequency (RF); high-k field plate; dual material gate; FIELD; TRANSISTORS; DEVICE; ANALOG; MODEL;
D O I
10.1088/1361-6641/ac93ac
中图分类号
TM [电工技术]; TN [电子技术、通信技术];
学科分类号
0808 ; 0809 ;
摘要
A drain-extended fin field-effect transistor (FinFET) with a dual material gate (DMG) and a high-k field plate (FP), named DF-DeFF, is proposed for high-voltage radio frequency (RF) applications. The FP induces the charge variation in the drain extension, which appears as either the extended depletion in the gate-off state or the electron accumulation in the gate-on state. Along with the FP, the DMG forms a step-like potential variation along the channel, which leads to electron acceleration and the screening effect on the drain-to-source voltage (V (DS)). These effects give significant advantages to the DC characteristics, including breakdown voltage (V (BD)) and on-resistance (R (on)), and the RF characteristics, including transconductance (g (m)) and output-resistance (r (o)). Compared to the latest high-voltage RF FinFETs, the DF-DeFF shows a drastic improvement in the major performance indicators such as V (BD), cut-off frequency (f (T)), and maximum oscillation frequency (f (MAX)). These results indicate that DF-DeFF is a FinFET with sufficient competitiveness even in high voltage circumstances.
引用
收藏
页数:8
相关论文
共 50 条
  • [41] High Voltage RF LDMOS Technology for Broadcast Applications
    Theeuwen, S. J. C. H.
    Sneijers, W. J. A. M.
    Klappe, J. G. E.
    de Boet, J. A. M.
    2008 EUROPEAN MICROWAVE INTEGRATED CIRCUITS CONFERENCE (EUMIC), 2008, : 24 - 27
  • [43] Performance Investigation of Silicon-on-Insulator Junctionless Drain Extended FinFET for High Power, Radio Frequency Applications
    Ajay
    SILICON, 2021, 13 (07) : 2381 - 2387
  • [44] Drain-Extended FinFET With Embedded SCR (DeFinFET-SCR) for High-Voltage ESD Protection and Self-Protected Designs
    Paul, Milova
    Kumar, B. Sampath
    Nagothu, Kranthi Karmel
    Singhal, Pulkit
    Gossner, Harald
    Shrivastava, Mayank
    IEEE TRANSACTIONS ON ELECTRON DEVICES, 2019, 66 (12) : 5072 - 5079
  • [45] Drain Extended Tunnel FET-A Novel Power Transistor for RF and Switching Applications
    Shrivastava, Mayank
    IEEE TRANSACTIONS ON ELECTRON DEVICES, 2017, 64 (02) : 481 - 487
  • [46] HIGH-VOLTAGE DC-POWER SUPPLIES FOR RF-KLYSTRON-TRANSMITTERS IN ACCELERATORS AND STORAGE-RINGS
    NARCISS, H
    BULLETIN OF THE AMERICAN PHYSICAL SOCIETY, 1981, 26 (02): : 142 - 142
  • [47] DC and RF performances of InAs FinFET and GAA MOSFET on insulator
    Cheng, Qi
    Shariar, Kazy
    Khandelwal, Sourabh
    Zeng, Yuping
    SOLID-STATE ELECTRONICS, 2019, 158 : 11 - 15
  • [48] Development of Cockcroft-Walton-type high-voltage DC generator with RF air-core transformer
    Matsubara, Yoshio
    Onishi, Kazuhiko
    Muraoka, Takashi
    Sugita, Michinobu
    Kurisawa, Hideaki
    Akita, Keizo
    Hamano, Masaru
    Nakazato, Hiroshi
    ELECTRICAL ENGINEERING IN JAPAN, 2007, 160 (01) : 18 - 26
  • [49] Development of Cockcroft-Walton type high-voltage DC generator with RF air-core transformer
    Matsubara, Yoshio
    Onishi, Kazuhiko
    Muraoka, Takashi
    Sugita, Michinobu
    Kurisawa, Hideaki
    Akita, Keizo
    Hamano, Masaru
    Nakazato, Hiroshi
    IEEJ Transactions on Power and Energy, 2006, 126 (03) : 379 - 385
  • [50] Reliability Enhancement by Doping Boron and Fluorine in Lightly Doped Drain Region of High-Voltage FinFET
    Yeh, Chien-Hung
    Chang, Ting-Chang
    Kuo, Ting-Tzu
    Hung, Wei-Chieh
    Lin, Jia-Hong
    Lee, Ya-Huan
    Yen, Wei-Ting
    Kuo, Hung-Ming
    Ciou, Fong-Min
    Chang, Kai-Chun
    Hung, Wei-Chun
    IEEE ELECTRON DEVICE LETTERS, 2023, 44 (06) : 971 - 974