Power-Efficient High-Frequency Integrated Circuits and Communication Systems Developed within Cool Silicon Cluster Project

被引:0
|
作者
Ellinger, F. [1 ,2 ]
Fettweis, G.
Tzschoppe, C. [1 ]
Carta, C. [1 ]
Fritsche, D. [1 ]
Tretter, G. [1 ]
Yodprasit, U. [1 ]
Paulo, R. [1 ]
Richter, A. [1 ]
Strobel, A. [1 ]
Wolf, R. [1 ]
Fehske, A. [2 ]
Isheden, C. [2 ]
Pawlak, A. [4 ]
Schroeter, M. [4 ]
Schumann, S. [1 ]
Hoeppner, S. [3 ]
Walter, D. [3 ]
Eisenreich, H. [3 ]
Schueffny, R. [3 ]
机构
[1] Tech Univ Dresden, Chair Circuit Design & Network Theory, Dresden, Germany
[2] Tech Univ Dresden, Vodafone Chair Mobile Commun Syst, Dresden, Germany
[3] Tech Univ Dresden, Chair Highly Parallel VLST Syst & Neuromorph Circ, Dresden, Germany
[4] Tech Univ Dresden, Chair Electron Devices & Integrated Circuits, Dresden, Germany
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中图分类号
TM [电工技术]; TN [电子技术、通信技术];
学科分类号
0808 ; 0809 ;
摘要
An overview about research activities in the field of high frequency integrated circuits and communication systems performed within the German cluster project Cool Silicon is given. Cool Silicon is located around Dresden/Silicon Saxony/Germany and features around 50 projects and 100 partners from industry and research institutions, and aims at significantly increasing the energy efficiency of information and communications technologies.
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