Flip chip solder joint reliability under harsh environment

被引：6
|
作者：
Cheng, B [1 ]
Wang, L
Zhang, Q
Gao, X
Xie, XM
Kempe, W
机构：
[1] Chinese Acad Sci, Shanghai Inst Microsyst & Informat Technol, Shanghai, Peoples R China
[2] DaimlerChrylser SIM Technol Co Ltd, Shanghai, Peoples R China
来源：
SOLDERING & SURFACE MOUNT TECHNOLOGY | 2003年 / 15卷 / 03期
关键词：
solder; joining processes; product reliability; laminates;
D O I：
10.1108/09540910310505071
中图分类号：
T [工业技术];
学科分类号：
08 ;
摘要：
Flip chip solder joint reliability under thermal shock stress was investigated both experimentally and by 2D finite element simulation. The results indicate that solder fatigue is the dominant failure mode and that delamination has obvious adverse effects on the solder joint lifetime. Different material/process combinations (underfill, flux, reflow atmospheres) were designed in order to understand the role of material/process factors on the solder joint lifetime and the results are discussed.
引用
收藏
页码：15 / 20
页数：6
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