Recent advances on SnBi low-temperature solder for electronic interconnections

被引：47

作者：

Jiang, Nan ^{[1
]}

Zhang, Liang ^{[1
,2
]}

Gao, Li-Li ^{[3
]}

Song, Xiao-Guo ^{[1
]}

He, Peng ^{[1
]}

机构：

[1] Harbin Inst Technol, State Key Lab Adv Welding & Joining, Harbin 150001, Peoples R China

[2] Jiangsu Normal Univ, Sch Mechatron Engn, Xuzhou 221116, Jiangsu, Peoples R China

[3] Shanghai Inst, Shanghai Inst Radio Equipment, Shanghai 200082, Peoples R China

来源：

JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS | 2021年 / 32卷 / 18期

关键词：

BI-CU SOLDER; MECHANICAL-PROPERTIES; SN-58BI SOLDER; INTERMETALLIC COMPOUNDS; TENSILE PROPERTIES; INTERFACIAL MICROSTRUCTURE; PARTICLES ADDITION; INDENTATION CREEP; INDIUM ADDITION; GROWTH-BEHAVIOR;

D O I：

10.1007/s10854-021-06820-7

中图分类号：

TM [电工技术]; TN [电子技术、通信技术];

学科分类号：

0808 ; 0809 ;

摘要：

SnBi lead-free solder is widely applied in the field of low-temperature soldering due to its excellent creep resistance, relatively low melting point (139 degrees C) and cost. However, the frangibility and poor ductility of the SnBi low-temperature solder limits its application in the field of electronic packaging. In this paper, the research progress and development direction of SnBi low-temperature lead-free solder are discussed. To promote the application of SnBi solder, the melting characteristics, wettability, microstructure, tensile properties, shear properties, creep properties and interfacial reaction of SnBi solder are analyzed and introduced systematically. It provides an important reference of understanding the current development of SnBi solders.

引用

页码：22731 / 22759

页数：29

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