Recent advances of nanolead-free solder material for low processing temperature interconnect applications

被引：26
|
作者：
Jiang, Hongjin [1 ]
Moon, Kyoung-sik [2 ]
Wong, C. P. [3 ]
机构：
[1] Intel Corp, Chandler, AZ 85226 USA
[2] Georgia Inst Technol, Sch Mat Sci & Engn, Atlanta, GA 30332 USA
[3] Chinese Univ Hong Kong, Fac Engn, Shatin, Hong Kong, Peoples R China
来源：
MICROELECTRONICS RELIABILITY | 2013年 / 53卷 / 12期
关键词：
LEAD-FREE SOLDERS; DEPENDENT MELTING PROPERTIES; TIN NANOPARTICLES; ALLOY NANOPARTICLES; BIMETALLIC NANOPARTICLES; SOLUTION DISPERSION; GOLD NANOPARTICLES; SIZE; PARTICLES; CLUSTERS;
D O I：
10.1016/j.microrel.2013.04.005
中图分类号：
TM [电工技术]; TN [电子技术、通信技术];
学科分类号：
0808 ; 0809 ;
摘要：
Recent advances of nanolead-free solder materials for microelectronic packaging is presented. The syntheses of Sn, SnAg and SnAgCu nanoparticles and their size dependent melting temperature are discussed. Capping nanoparticle surfaces with organic molecules for antioxidation and particle size control is studied as well. An in-house made nanosolder pastes is formulated and its metallurgical joint onto a Cu substrate is demonstrated. (C) 2013 Published by Elsevier Ltd.
引用
收藏
页码：1968 / 1978
页数：11
相关论文
共 50 条
  • [1] Recent advances on SnBi low-temperature solder for electronic interconnections
    Jiang, Nan
    Zhang, Liang
    Gao, Li-Li
    Song, Xiao-Guo
    He, Peng
    JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS, 2021, 32 (18) : 22731 - 22759
  • [2] Recent advances on SnBi low-temperature solder for electronic interconnections
    Nan Jiang
    Liang Zhang
    Li-Li Gao
    Xiao-Guo Song
    Peng He
    Journal of Materials Science: Materials in Electronics, 2021, 32 : 22731 - 22759
  • [3] Low Processing Temperature of Lead-Free Solder Interconnects
    Jiang, Hongjin
    Wong, C. P.
    IEEE NANOTECHNOLOGY MAGAZINE, 2010, 4 (02) : 20 - 23
  • [4] Advances in Pb-free Solder Microstructure Control and Interconnect Design
    Kathlene N. Reeve
    John R. Holaday
    Stephanie M. Choquette
    Iver E. Anderson
    Carol A. Handwerker
    Journal of Phase Equilibria and Diffusion, 2016, 37 : 369 - 386
  • [5] Advances in Pb-free Solder Microstructure Control and Interconnect Design
    Reeve, Kathlene N.
    Holaday, John R.
    Choquette, Stephanie M.
    Anderson, Iver E.
    Handwerker, Carol A.
    JOURNAL OF PHASE EQUILIBRIA AND DIFFUSION, 2016, 37 (04) : 369 - 386
  • [6] Recent Development of Nano-solder Paste for Electronics Interconnect Applications
    Liu, Johan
    Andersson, Cristina
    Gao, Yulai
    Zhai, Qijie
    EPTC: 2008 10TH ELECTRONICS PACKAGING TECHNOLOGY CONFERENCE, VOLS 1-3, 2008, : 84 - +
  • [7] Recent Advances on Thermoelectric Silicon for Low-Temperature Applications
    Narducci, Dario
    Giulio, Federico
    MATERIALS, 2022, 15 (03)
  • [8] RECENT ADVANCES IN LOW TEMPERATURE
    MEADEN, GT
    CRYOGENICS, 1968, 8 (06) : 339 - &
  • [9] Recent Advances in the Synthesis of Lead-free Solder Nanoparticle
    Andersson, Cristina
    Zou, Changdong
    Yang, Bin
    Ga, Yulai
    Liu, Johan
    Zhai, Qijie
    ESTC 2008: 2ND ELECTRONICS SYSTEM-INTEGRATION TECHNOLOGY CONFERENCE, VOLS 1 AND 2, PROCEEDINGS, 2008, : 915 - +
  • [10] Applications of low temperature, AC superconducting magnets to material processing
    Kasahara, Hirofumi
    Fujioka, Koji
    Taniguchi, Shoji
    Ueno, Kazuyuki
    Shimasaki, Shin-ichi
    IEEE TRANSACTIONS ON APPLIED SUPERCONDUCTIVITY, 2006, 16 (02) : 1112 - 1115
12345