Recent advances of nanolead-free solder material for low processing temperature interconnect applications

被引：26
|
作者：
Jiang, Hongjin [1 ]
Moon, Kyoung-sik [2 ]
Wong, C. P. [3 ]
机构：
[1] Intel Corp, Chandler, AZ 85226 USA
[2] Georgia Inst Technol, Sch Mat Sci & Engn, Atlanta, GA 30332 USA
[3] Chinese Univ Hong Kong, Fac Engn, Shatin, Hong Kong, Peoples R China
来源：
MICROELECTRONICS RELIABILITY | 2013年 / 53卷 / 12期
关键词：
LEAD-FREE SOLDERS; DEPENDENT MELTING PROPERTIES; TIN NANOPARTICLES; ALLOY NANOPARTICLES; BIMETALLIC NANOPARTICLES; SOLUTION DISPERSION; GOLD NANOPARTICLES; SIZE; PARTICLES; CLUSTERS;
D O I：
10.1016/j.microrel.2013.04.005
中图分类号：
TM [电工技术]; TN [电子技术、通信技术];
学科分类号：
0808 ; 0809 ;
摘要：
Recent advances of nanolead-free solder materials for microelectronic packaging is presented. The syntheses of Sn, SnAg and SnAgCu nanoparticles and their size dependent melting temperature are discussed. Capping nanoparticle surfaces with organic molecules for antioxidation and particle size control is studied as well. An in-house made nanosolder pastes is formulated and its metallurgical joint onto a Cu substrate is demonstrated. (C) 2013 Published by Elsevier Ltd.
引用
收藏
页码：1968 / 1978
页数：11
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