Development of High Temperature Operation SiC Power Module

被引:4
|
作者
Sato, Shinji [1 ]
Kato, Fumiki [1 ]
Tanisawa, Hidekazu [1 ,2 ]
Koui, Kenichi [1 ,3 ]
Watanabe, Kinuyo [1 ]
Murakami, Yoshinori [1 ,4 ]
Sato, Hiroshi [1 ]
Yamaguchi, Hiroshi [1 ]
机构
[1] Natl Inst Adv Ind Sci & Technol, Tokyo, Japan
[2] Sanken Elect Co Ltd, Niiza, Japan
[3] Calson Kansei Corp, Saitama, Japan
[4] Nissan Motor Co Ltd, Yokohama, Kanagawa, Japan
关键词
D O I
10.1149/08612.0083ecst
中图分类号
T [工业技术];
学科分类号
08 ;
摘要
We have developed SiC power module which realizes operation at high temperature of 250 degrees C or higher. The withstand voltage of this power module is 1200 V, and two SiC-MOSFETs are built in and constitute a circuit for one inverter phase. This power module incorporates a snubber circuit for reducing the surge voltage generated by the SiC-MOSFET during switching. Joining of the main parts in the module is done with eutectic solder with a solidus line of 350 degrees C or higher. It can operate in high temperatures up to 250 degrees C and ensures reliability at that temperature. We conducted 100 A switching test using this module. High speed switching was realized, and the turn-off switching time tf was about the same about 10 ns from room temperature to 250 degrees C. In this paper, we describe the design and performance of the developed power module.
引用
收藏
页码:83 / 90
页数:8
相关论文
共 50 条
  • [1] Metallization Technology of SiC Power Module in High Temperature Operation
    Iwashige, Tomohito
    Sugiura, Kazuhiko
    Endo, Takeshi
    Tsuruta, Kazuhiko
    Sakuma, Yuichi
    Kurosaka, Seigo
    Oda, Yukinori
    Chen, Chuantong
    Nagao, Shijo
    Suganuma, Katsuaki
    [J]. 2018 INTERNATIONAL CONFERENCE ON ELECTRONICS PACKAGING AND IMAPS ALL ASIA CONFERENCE (ICEP-IAAC), 2018, : 371 - 374
  • [2] Development of SiC Power Module for High-Speed Switching Operation
    Sato, Hiroshi
    Katol, Fumiki
    Nakagawa, Hiroshi
    Yamaguchi, Hiroshi
    Rejeki, Simanjorang
    Lang, Fengqun
    [J]. 2013 IEEE ELECTRICAL DESIGN OF ADVANCED PACKAGING AND SYSTEMS SYMPOSIUM (EDAPS), 2013, : 13 - 16
  • [3] Development of high temperature and frequency operation module using SiC semiconductor
    Tanisawa H.
    Sato S.
    Kato H.
    Koui K.
    Watanabe K.
    [J]. 2018, Japan Welding Society (87): : 499 - 502
  • [4] Development of SiC power module capable of high-temperature and high-speed operation with passive components
    Sato H.
    [J]. Journal of Japan Institute of Electronics Packaging, 2019, 22 (06) : 523 - 528
  • [5] High-Temperature High-Power Operation of a 100 A SiC DMOSFET Module
    Salem, T. E.
    Urciuoli, D. P.
    Green, R.
    Ovrebo, G. K.
    [J]. APEC: 2009 IEEE APPLIED POWER ELECTRONICS CONFERENCE AND EXPOSITION, VOLS 1- 4, 2009, : 653 - +
  • [6] HIGH TEMPERATURE SiC POWER MODULE PACKAGING
    Rowden, Brian
    Mantooth, Alan
    Ang, Simon
    Lostetter, Alex
    Hornberger, Jared
    McPherson, Brice
    [J]. IMCE2009: PROCEEDINGS OF THE ASME INTERNATIONAL MECHANICAL ENGINEERING CONGRESS AND EXPOSITION, VOL 5, 2010, : 85 - 90
  • [7] A study on electro thermal response of SiC power module during high temperature operation
    Funaki, Tsuyoshi
    Nishio, Akira
    Kimoto, Tsunenobu
    Hikihara, Takashi
    [J]. IEICE ELECTRONICS EXPRESS, 2008, 5 (16): : 597 - 602
  • [8] A High Density 250 °C Junction Temperature SiC Power Module Development
    Ning, Puqi
    Wang, Fei
    Zhang, Di
    [J]. IEEE JOURNAL OF EMERGING AND SELECTED TOPICS IN POWER ELECTRONICS, 2014, 2 (03) : 415 - 424
  • [9] Characterization of SiC power module for high switching frequency operation
    Funaki, Tsuyoshi
    Inoue, Hiroyasu
    Sasagawa, Masashi
    Nakamura, Takashi
    [J]. IEICE ELECTRONICS EXPRESS, 2010, 7 (14): : 1008 - 1013
  • [10] Multi-Chip SiC DMOSFET Half-Bridge Power Module for High Temperature Operation
    Funaki, Tsuyoshi
    Sasagawa, Masashi
    Nakamura, Takashi
    [J]. 2012 TWENTY-SEVENTH ANNUAL IEEE APPLIED POWER ELECTRONICS CONFERENCE AND EXPOSITION (APEC), 2012, : 2525 - 2529