A novel electro-thermal actuated micro position lock

被引:0
|
作者
Guo, H [1 ]
Zhang, HX [1 ]
机构
[1] Peking Univ, Inst Microelect, Beijing 100871, Peoples R China
关键词
MEMS; micro-electro-mechanical systems; thermal actuator; bent-beam; cold and hot arm;
D O I
暂无
中图分类号
TM [电工技术]; TN [电子技术、通信技术];
学科分类号
0808 ; 0809 ;
摘要
This paper presents a novel electro-thermal actuated micro position lock. The device consumes power only during switching operation, and with no standby power consuming at all. This feature can extremely reduce power consumption and extend the device reliability. The device needs 5V to drive which is compatible with conventional CMOS logic. This kind of position lock could be used in controlling micro-tube, which is an essential component in Bio-MEMS chips and microfluidic chips.
引用
收藏
页码:1915 / 1918
页数:4
相关论文
共 50 条
  • [41] COUPLED ELECTRO-THERMAL SIMULATION OF MOSFETs
    Ni, Chunjian
    Aksamija, Zlatan
    Murthy, Jayathi Y.
    Ravaioli, Umberto
    IPACK 2009: PROCEEDINGS OF THE ASME INTERPACK CONFERENCE 2009, VOL 1, 2010, : 161 - 173
  • [42] MODELING AND ANALYSIS OF ELECTRO-THERMAL MICROACTUATORS
    Lo, Chih-Ching
    Lin, Meng-Ju
    Hwan, Chung-Li
    JOURNAL OF THE CHINESE INSTITUTE OF ENGINEERS, 2009, 32 (03) : 351 - 360
  • [43] Electro-thermal behavior of solid armatures
    Angeli, Marco
    Cardelli, Ermanno
    IEEE Transactions on Magnetics, 1999, 35 (1 pt 1): : 47 - 52
  • [44] Electro-thermal behavior of solid armatures
    Angeli, M
    Cardelli, E
    IEEE TRANSACTIONS ON MAGNETICS, 1999, 35 (01) : 47 - 52
  • [45] Electro-Thermal Analysis of Contact Resistance
    Pandey, Nitin
    Jain, Ishant
    Reddy, Sudhakar
    Gulhane, Nitin P.
    INTERNATIONAL CONFERENCE ON INVENTIVE RESEARCH IN MATERIAL SCIENCE AND TECHNOLOGY (ICIRMCT 2018), 2018, 1966
  • [46] Dynamics of Resistive Electro-Thermal Nonlinearity
    Schuchinsky, Alex
    Steer, Michael
    2017 IEEE MTT-S INTERNATIONAL CONFERENCE ON NUMERICAL ELECTROMAGNETIC AND MULTIPHYSICS MODELING AND OPTIMIZATION FOR RF, MICROWAVE, AND TERAHERTZ APPLICATIONS (NEMO), 2017, : 73 - 75
  • [47] Electro-thermal simulation with the SISSI package
    Székely, V
    Páhi, A
    Poppe, A
    Rencz, M
    ANALOG INTEGRATED CIRCUITS AND SIGNAL PROCESSING, 1999, 21 (01) : 21 - 31
  • [48] Electro-thermal resonance in MOSFET devices
    Codecasa, L
    D'Amore, D
    Maffezzoni, P
    ELECTRONICS LETTERS, 2001, 37 (01) : 57 - 58
  • [49] Electro-Thermal Simulation with the SISSI Package
    V. Sze´kely
    A. Pa´hi
    A. Poppe
    M. Rencz
    Analog Integrated Circuits and Signal Processing, 1999, 21 : 21 - 31
  • [50] Electro-thermal antimicrobial carbon surface
    Heo, Ki Joon
    Lee, Yeawan
    Kim, Sang Bok
    Kim, Hak-Joon
    2021 IEEE INDUSTRY APPLICATIONS SOCIETY ANNUAL MEETING (IAS), 2021,