Piezoresistive effect in top-down fabricated silicon nanowires

被引:0
|
作者
Reck, K. [1 ]
Richter, J. [1 ]
Hansen, O. [1 ]
Thomsen, E. V. [1 ]
机构
[1] Tech Univ Denmark, DK-2800 Lyngby, Denmark
来源
MEMS 2008: 21ST IEEE INTERNATIONAL CONFERENCE ON MICRO ELECTRO MECHANICAL SYSTEMS, TECHNICAL DIGEST | 2008年
关键词
D O I
暂无
中图分类号
TM [电工技术]; TN [电子技术、通信技术];
学科分类号
0808 ; 0809 ;
摘要
Encouraged by the results of He and Yang [1], we have designed and fabricated silicon test chips to investigate the piezoresistive properties of both crystalline and polycrystalline nanowires using a top-down approach, in order to comply with conventional fabrication techniques. The test chip consists of 5 silicon nanowires and a reference resistor, each with integrated contacts for electrical 4-point measurements. We show an increase in the piezoresistive effect of 633% compared to bulk silicon. Preliminary temperature measurements indicate a larger temperature dependence of silicon nanowires, compared to bulk silicon. An increase of up to 34% compared to bulk polysilicon is observed in polysilicon nanowires with decreasing dimensions.
引用
收藏
页码:717 / 720
页数:4
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