Investigation of dissolution behavior of metallic substrates and intermetallic compound in molten lead-free solders

被引：42
|
作者：
Yen, Yee-Wen [1 ]
Chou, Weng-Ting [2 ]
Tseng, Yu [2 ]
Lee, Chiapyng [2 ]
Hsu, Chun-Lei [1 ]
机构：
[1] Natl Taiwan Univ Sci & Technol, Grad Inst Mat Sci & Technol, Taipei 106, Taiwan
[2] Natl Taiwan Univ Sci & Technol, Dept Chem Engn, Taipei 106, Taiwan
来源：
JOURNAL OF ELECTRONIC MATERIALS | 2008年 / 37卷 / 01期
关键词：
dissolution behavior; intermetallic compound (IMC); dissolution mechanism; grain boundary; lattice diffusion;
D O I：
10.1007/s11664-007-0266-6
中图分类号：
TM [电工技术]; TN [电子技术、通信技术];
学科分类号：
0808 ; 0809 ;
摘要：
This study investigates the dissolution behavior of the metallic substrates Cu and Ag and the intermetallic compound (IMC)-Ag3Sn in molten Sn, Sn-3.0Ag-0.5Cu, Sn-58Bi and Sn-9Zn (in wt.%) at 300, 270 and 240 degrees C. The dissolution rates of both Cu and Ag in molten solder follow the order Sn > Sn-3.0Ag-0.5Cu > Sn-58Bi > Sn-9Zn. Planar Cu3Sn and scalloped Cu6Sn5 phases in Cu/solders and the scalloped Ag3Sn phase in Ag/solders are observed at the metallic substrate/solder interface. The dissolution mechanism is controlled by grain boundary diffusion. The planar Cu5Zn8 layer formed in the Sn-9Zn/Cu systems. AgZn3, Ag5Zn(8) and AgZn phases are found in the Sn-9Zn/Ag system and the dissolution mechanism is controlled by lattice diffusion. Massive Ag3Sn phases dissolved into the solders and formed during solidification processes in the Ag3Sn/Sn or Sn-3.0Ag-0.5Cu systems. AgZn3 and Ag5Zn8 phases are formed at the Sn-9Zn/Ag3Sn interface. Zn atoms diffuse through Ag-Zn IMCs to form (Ag, Zn)Sn-4 and Sn-rich regions between Ag5Zn8 and Ag3Sn.
引用
收藏
页码：73 / 83
页数：11
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