Investigation of dissolution behavior of metallic substrates and intermetallic compound in molten lead-free solders

被引：42
|
作者：
Yen, Yee-Wen [1 ]
Chou, Weng-Ting [2 ]
Tseng, Yu [2 ]
Lee, Chiapyng [2 ]
Hsu, Chun-Lei [1 ]
机构：
[1] Natl Taiwan Univ Sci & Technol, Grad Inst Mat Sci & Technol, Taipei 106, Taiwan
[2] Natl Taiwan Univ Sci & Technol, Dept Chem Engn, Taipei 106, Taiwan
来源：
JOURNAL OF ELECTRONIC MATERIALS | 2008年 / 37卷 / 01期
关键词：
dissolution behavior; intermetallic compound (IMC); dissolution mechanism; grain boundary; lattice diffusion;
D O I：
10.1007/s11664-007-0266-6
中图分类号：
TM [电工技术]; TN [电子技术、通信技术];
学科分类号：
0808 ; 0809 ;
摘要：
This study investigates the dissolution behavior of the metallic substrates Cu and Ag and the intermetallic compound (IMC)-Ag3Sn in molten Sn, Sn-3.0Ag-0.5Cu, Sn-58Bi and Sn-9Zn (in wt.%) at 300, 270 and 240 degrees C. The dissolution rates of both Cu and Ag in molten solder follow the order Sn > Sn-3.0Ag-0.5Cu > Sn-58Bi > Sn-9Zn. Planar Cu3Sn and scalloped Cu6Sn5 phases in Cu/solders and the scalloped Ag3Sn phase in Ag/solders are observed at the metallic substrate/solder interface. The dissolution mechanism is controlled by grain boundary diffusion. The planar Cu5Zn8 layer formed in the Sn-9Zn/Cu systems. AgZn3, Ag5Zn(8) and AgZn phases are found in the Sn-9Zn/Ag system and the dissolution mechanism is controlled by lattice diffusion. Massive Ag3Sn phases dissolved into the solders and formed during solidification processes in the Ag3Sn/Sn or Sn-3.0Ag-0.5Cu systems. AgZn3 and Ag5Zn8 phases are formed at the Sn-9Zn/Ag3Sn interface. Zn atoms diffuse through Ag-Zn IMCs to form (Ag, Zn)Sn-4 and Sn-rich regions between Ag5Zn8 and Ag3Sn.
引用
收藏
页码：73 / 83
页数：11
相关论文
共 50 条
  • [1] Investigation of Dissolution Behavior of Metallic Substrates and Intermetallic Compound in Molten Lead-free Solders
    Yee-Wen Yen
    Weng-Ting Chou
    Yu Tseng
    Chiapyng Lee
    Chun-Lei Hsu
    Journal of Electronic Materials, 2008, 37 : 73 - 83
  • [2] Dissolution of stainless steels in molten lead-free solders
    Takemoto, Tadashi
    Takemoto, Masaharu
    SOLDERING & SURFACE MOUNT TECHNOLOGY, 2006, 18 (03) : 24 - 30
  • [3] High dissolution rate of solid materials in molten lead-free solders
    Takemoto, Tadashi
    ADVANCED WELDING AND MICRO JOINING / PACKAGING FOR THE 21ST CENTURY, 2008, 580-582 : 205 - 208
  • [4] Intermetallic Compound Formation On Lead-Free Solders By Using Microwave Energy
    Faizal, Mohamad S.
    Azlina, Saliza O.
    INTERNATIONAL CONFERENCE ON ADVANCED SCIENCE, ENGINEERING AND TECHNOLOGY (ICASET 2015), 2016, 1774
  • [5] Analysis of Intermetallic Compounds in Lead-free Solders
    Pietrikova, Alena
    Durisin, Juraj
    Urbancik, Jan
    Bansky, Juraj
    2009 32ND INTERNATIONAL SPRING SEMINAR ON ELECTRONICS TECHNOLOGY, 2009, : 263 - 267
  • [6] Thermal Conductivity of Molten Lead-Free Solders
    J. Bilek
    J. K. Atkinson
    W. A. Wakeham
    International Journal of Thermophysics, 2006, 27 : 92 - 102
  • [7] Thermal conductivity of molten lead-free solders
    Bilek, J.
    Atkinson, J. K.
    Wakeham, W. A.
    INTERNATIONAL JOURNAL OF THERMOPHYSICS, 2006, 27 (01) : 92 - 102
  • [8] Dissolution behavior of the Ni substrate and Ni3Sn4 phase in molten lead-free solders
    Yen, Y. W.
    Lin, C. Y.
    Yan, J.
    Chang, Y. W.
    Wang, C. H.
    Guo, M. H.
    INTERNATIONAL JOURNAL OF MODERN PHYSICS B, 2018, 32 (19):
  • [9] Dissolution rates of iron plating on soldering iron tips in molten lead-free solders
    Takemoto, T
    Uetani, T
    Yamazaki, M
    SOLDERING & SURFACE MOUNT TECHNOLOGY, 2004, 16 (03) : 9 - 15
  • [10] INTERMETALLIC COMPOUNDS FORMED BETWEEN Cu SUBSTRATES AND LEAD-FREE SOLDERS CONTAINING Ce
    Chriastelova, Janka
    Dimova, Katarina Pociskova
    Trnkova, Lydia Rizekova
    Lokaj, Jan
    Turna, Milan
    Ozvold, Milan
    METAL 2010: 19TH INTERNATIONAL METALLURGICAL AND MATERIALS CONFERENCE, 2010, : 770 - 775
12345